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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,421 open positions
IC Design Engineer
Silabs
Singapore
2mo
Designing digital circuits and integrating them into System-on-Chip (SoC) infrastructure for low-power wireless connectivity solutions.
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Senior RTL / Digital IC Design Engineer
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Sparkgrid Pte. Ltd.
Clementi, S00, SG
2mo
Develop high-performance digital logic for Optical DSP (ODSP) and communication ASIC products, including RTL implementation, micro-architecture development, and silicon bring-up.
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Physical Design Implementation and STA Lead
Altera
San Jose, California, United States
$149k–$149k
2mo
Lead physical design implementation and static timing analysis (STA) for next-generation FPGA SoCs, driving closure from floorplanning through signoff.
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Functional Safety Architect
Altera
San Jose, California, United States
$149k–$149k
2mo
Lead functional safety activities and device safety architecture for next-generation semiconductor devices across Avionics, Space, Defense, Automotive, and Industrial markets.
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Senior Engineer, RTL Design
Arm
Bengaluru, India
2mo
Designing complex compute subsystems and System-on-Chip (SoC) logic, integrating IP, and developing micro-architecture specifications.
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Staff Digital Design Engineer
Renesas-Electronics
Chandler, Arizona, us
2mo
Architecting, designing, and integrating low-power digital circuits for mixed-signal data conversion and power management products in advanced process nodes.
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Principal Hardware Engineer, AI Systems
Microsoft
United States, Washington, Redmond
2mo
End-to-end technical owner for next-generation AI and GPU platforms from architecture handoff through production deployment and fleet readiness.
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Senior Silicon Engineer
Microsoft
United States, California, Santa Clara
2mo
Designing modules for programmable silicon implementation and microarchitecture within a datacenter DPU silicon team.
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Sr. Staff Physical Design Timing Engineer (STA)
Lightmatter
Mountain View, CA
$191k–$191k
2mo
Drive backend digital execution and timing closure for leading-edge silicon photonics chips in extreme-scale data centers.
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Staff Physical Design Engineer
Lightmatter
Mountain View, CA
$196k–$196k
2mo
Implementing complex digital blocks for high-performance ASICs in advanced process nodes (3nm), focusing on timing closure, power integrity, and physical verification for photonics engines.
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Staff Engineer, Physical Design
Renesas-Electronics
Remote
2mo
Lead MCU/subsystem/block-level physical design closure efforts for complex hierarchical SoCs, focusing on timing, congestion, power integrity, and implementation.
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Automotive High-Speed Hardware Design Engineer
Bosch-Group
Bengaluru, in
2mo
Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, focusing on high-speed digital boards and sensor integration.
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Staff Board Package Design Engineer
Renesas-Electronics
Hyderabad, in
2mo
Lead board and package design for high-performance SOCs/MCUs from block level to final delivery.
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Senior Physical Design Engineer
Microsoft
India, Karnataka, Bangalore
2mo
Senior Physical Design Engineer responsible for physical design implementation and integration of cutting-edge semiconductor products at block, subsystem, sub-chip, and full-chip levels.
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Principal Physical Design Engineer
Microsoft
India, Karnataka, Bangalore
2mo
Leading physical design implementation and integration for cutting-edge semiconductor products at block, subsystem, sub-chip, and full-chip levels.
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Principal ASIC Design Engine
Nxp
Hyderabad
2mo
Designing and implementing complex digital blocks and subsystems for next-generation AI inference accelerators and SoCs.
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Principal High-Speed I/O Architect (PCIe, CXL, UA Link)
Arm
Austin, Texas
$250k–$250k
2mo
Design and define innovative on-chip interconnect architectures (coherent and non-coherent) for scalable SoC platforms across mobile, automotive, datacenter, networking, and IoT markets.
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Senior ASIC Timing Engineer
NVIDIA
US, CA, Santa Clara
$136k–$136k
2mo
Lead timing analysis and closure for NVIDIA GPUs, CPUs, LPUs, and SoCs at block, cluster, and full chip levels.
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Principal Hardware ASIC Architect engineer
Nxp
Hyderabad
2mo
Define and own architecture for compute, memory, interconnect, and high-speed interface subsystems in AI inference chips, balancing performance, power, and area (PPA) from concept through silicon.
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Lead FPGA Design Engineer
Jabil
Austin, TX
2mo
Leading FPGA design, development, integration, and debug for complex server, storage, networking, and AI infrastructure platforms.
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Senior STA Engineer
MediaTek
Austin, TX
2mo
Senior STA Engineer responsible for timing sign-off, constraint development, and margin methodology for mobile CPU blocks in next-generation SoCs.
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Senior RTL Design Engineer
Arm
Bristol, United Kingdom
2mo
Designing sophisticated micro-architecture and RTL for innovative IPs used in Physical AI, Automotive, Edge, and Infrastructure computing.
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ASIC Implementation Engineer STA
Broadcom
USA-CA San Jose Innovation Drive
$144k–$144k
2mo
Ensuring ASIC meets performance targets and timing requirements across all operating conditions via full-chip static timing analysis (STA) and sign-off.
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Associate Staff/Staff Implementation Design Engineer
Silabs
Singapore
2mo
Leading and hands-on execution of backend (BE) implementation flow for high-performance SoCs and ASICs, ensuring timing closure and PPA optimization.
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ASIC Implementation Engineer PD
Broadcom
USA-CA San Jose Innovation Drive
$122k–$122k
2mo
ASIC top level floorplan Physical Design Engineer responsible for taking RTL to silicon tape-out for AI and PCIe Switch products.
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Functional Safety Architect
Altera
Bengaluru, Karnataka, India
2mo
Own device safety architecture and lead efforts to achieve safety goals by developing technical safety concepts and allocating decomposed safety requirements for next-generation semiconductor devices.
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Design Engineer II
Cadence
HYDERABAD
2mo
Developing, automating, and maintaining EDA flows and scripts for physical implementation of IP cores and soft controllers to optimize performance and power.
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Sr. RTL Design Engineer (Silicon Engineering)
SpaceX
Austin - 800
$165k–$165k
2mo
Developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures to enable global connectivity via the Starlink network.
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RTL Design Engineer (Silicon Engineering)
SpaceX
Irvine, CA
$125k–$125k
2mo
Designing next-generation FPGAs and ASICs for Starlink satellite and ground infrastructure to enable global broadband connectivity.
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Principal Platform Power and Performance Engineer
Microsoft
United States, Washington, Redmond
2mo
Lead technical strategy and optimization for silicon and platform power-performance architecture, focusing on AI infrastructure, datacenter efficiency, and workload characterization.
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Principal Engineer, Digital IC Design and Architecture
Analogdevices
US, OR, Beaverton
$157k–$157k
2mo
Architect and design digital blocks and subsystems for high-speed SerDes ICs, driving next-gen automotive connectivity standards and enabling data transport for autonomous driving and digital cockpits.
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Principal NoC IP Micro-Architect
Altera
San Jose, California, United States
$210k–$210k
2mo
Designing and leading the end-to-end architecture, microarchitecture, and RTL development of scalable Network-on-Chip (NoC) IP solutions for next-generation FPGA platforms.
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System Architect for Advanced Memory System Architecture- DMTS/SMTS
Micron
Bengaluru, India
2mo
Designing next-generation memory and storage subsystem architectures for AI, servers, and mobile systems, optimizing power and performance through system-level simulation and modeling.
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Senior ASIC Design Engineer
NVIDIA
US, CA, Santa Clara
$168k–$168k
2mo
Implement, document, and deliver high-performance, area, and power-efficient RTL for NVIDIA's leading SoCs and GPUs, focusing on micro-architecture, scheduling, and interconnects.
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Digital IC Design Engineer (INT TRX)
Texas Instruments
Dallas, TX, United States
2mo
Architect and design high-performance digital circuits interfacing with analog systems for automotive and industrial applications.
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Engineer, Firmware Design
Micron
Hyderabad - Phoenix Aquila, India
2mo
Design and validation of on-chip controller and mixed signal circuitry in NAND FLASH chips.
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Principal Engineer
Arm
Bengaluru, India
2mo
Design and test new hardware modules to implement innovative imaging algorithms and video codecs for Image Signal Processors (ISPs), Display Processors, and Video codecs within Arm Compute Subsystems.
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Physical Design Engineer
NVIDIA
Israel, Tel Aviv
2mo
Designing and implementing advanced hardware solutions for next-generation AI and computing platforms, focusing on high-speed digital build and signal integrity.
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Principal FPGA Engineer (f/m/d)
Nxp
Hamburg, DE
2mo
Define and advance FPGA strategy, methodologies, and design flows while developing FPGA-based prototyping platforms for mobile payment and security solutions.
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ASIC Design Engineer
NVIDIA
US, CA, Santa Clara
$116k–$190k
2mo
Designing high-performance, power-efficient RTL for SoC and GPU products including microarchitecture, IPs, and system components.
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Firmware Design Engineer
Cadence
MOUNT-ROYAL (Montreal), CA
$74k–$137k
2mo
Developing physical IP for industry-standard high-speed serial-link protocols, specifically firmware for SERDES PHYs.
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Senior Engineer, Digital Design Engineer
Analogdevices
US, MA, Wilmington
$117k–$117k
2mo
Lead methodology improvements for physical design flows across complex chip and SoC programs to enhance scalability, reuse, efficiency, and predictability.
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Staff SSD Hardware PCIe Engineer
Micron
Boise, ID - Main Site
$138k–$138k
2mo
Developing modern SSD controller technologies and implementing high-impact solutions for performance and reliability.
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SOC Architect - Chiplet
Tenstorrent
Remote
2mo
Architecting the central compute chiplet for next-generation automotive SoCs, translating safety requirements into high-performance silicon designs.
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Physical Design Engineer, PnR
Tenstorrent
Santa Clara
$100k–$100k
2mo
Implement high-performance partitions for an industry-leading AI SOC, owning the complete implementation flow from synthesis to tapeout.
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Sr. Engineer, CPU RTL Design
Tenstorrent
Santa Clara
$100k–$100k
2mo
Designing and implementing RTL for high-performance RISC-V CPU blocks, focusing on microarchitecture definition and optimization.
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Engineering Program Manager, RISCV
Tenstorrent
Santa Clara
$100k–$100k
2mo
Leading the full lifecycle of a high-performance RISC-V CPU from specification to tapeout and post-silicon debug.
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AI/ML Physical Design Flow Engineer
Tenstorrent
Austin
$100k–$100k
2mo
Architecting and deploying AI/ML-driven solutions into production physical design flows to improve PPA and runtime on advanced semiconductor nodes.
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Physical Design Engineer - STA
Tenstorrent
Austin
$100k–$100k
2mo
Drive static timing analysis (STA) and closure for complex, high-performance RISC-V CPUs and AI SoCs to meet aggressive performance goals.
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Chiplet Physical Design Engineer
Tenstorrent
Remote
$100k–$100k
2mo
Designing and integrating multiple chiplets into a System-in-Package (SiP) for high-performance CPU and AI silicon.
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