Chiplet Physical Design Engineer
Core
Designing and integrating multiple chiplets into a System-in-Package (SiP) for high-performance CPU and AI silicon.
Role type
Senior IC physical design engineer (chiplet/SiP)
Builds
High-speed CPU core designs and AI silicon on advanced process nodes
Domain
Semiconductor / CPU / AI hardware
Deliverable
production ML models
Required skills
Synthesis, place-and-route, timing closure, ECO flows, PV convergence, scripting (TCL, Python)
Preferred skills
Mentoring, influencing methodology, global collaboration
Technologies
Synopsys, Cadence, 3nm and below nodes
Responsibilities
Own critical aspects of synthesis and place-and-route for high-speed CPU core designs; collaborate with global teams and external partners to deliver world-class silicon; contribute to performance, power, and area outcomes.
Seniority
Senior, hands-on IC
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