Staff Board Package Design Engineer
Core
Lead board and package design for high-performance SOCs/MCUs from block level to final delivery.
Role type
Staff Board Package Design Engineer
Builds
High-performance System-on-Chip (SoC) and Microcontroller Unit (MCU) products
Domain
Semiconductor hardware engineering (SoC/MCU design, packaging, and board-level systems)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Board and package design, Microcontroller/Microprocessor complex design, Packaging technologies and manufacturing processes, System clocking, Power management, Debug, High-speed interface design (PCIe, LPDDR, UFS, Ethernet), Schematic/Layout/BOM generation, SoC bring-up, PCB technologies and stackup design, IC packaging layout (SiP, flip-chip, 3D packaging), Thermal control and signal fidelity, Automation scripting (Python, TCL)
Preferred skills
Board level System architecture, SOC specifications, PMIC specifications, DC/AC simulations, Ansys HFSS, Cadence SI/PI, Cadence APD, SIwave, HSPICE, ADS, Q3D, Thermal simulation, Semiconductor manufacturing methodologies
Technologies
PCIe Gen3/4/5, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory, Ansys HFSS, Cadence SI/PI, Cadence APD, SIwave, HSPICE, ADS, Q3D, Python, TCL
Responsibilities
Define, develop, and execute product plans from specification to release, Drive team execution with minimal supervision, Perform board level DC/AC simulations, Conduct IC packaging layout design emphasizing advanced technologies, Automate SI, PI, and Packaging activities using scripting tools
Seniority
Staff, hands-on IC leader
