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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,421 open positions
DSP Firmware Engineer
Marvell
Cordoba, Argentina
6mo
Design, simulate, implement, and validate DSP ASICs for coherent optical transmission in fiber networks.
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Physical Design Engineer
MediaTek
Bangalore
6mo
Own planning, execution, and closure of complex digital blocks, managing floorplanning, placement, CTS, routing, and timing closure to ensure signoff readiness.
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Digital Design Manager
Texas Instruments
Bengaluru, Karnataka, India
6mo
End-to-end delivery of the first T28 industrial ASIC, combining full chip ownership with RTL team leadership to ensure first-time-right silicon and scalable architecture.
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Engineer/Staff Engineer – Chip Physical Verification Engineer
MediaTek
Singapore
7mo
Define and enable physical sign-off flow and solutions for System-on-Chip (SOC) design in advanced technology nodes.
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Design Engineer
Broadcom
USA-Colorado-Fort Collins-4380 Ziegler Road
$60k–$60k
7mo
Physical implementation of high-performance custom CMOS ASICs for AI, Cellular, Networking, Computing, and Storage products.
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Firmware Development Engineer
Altera
Jerusalem, Israel
7mo
Develop firmware for multi-protocol high-speed SERDES (up to 256Gbps) governing DSP and analog blocks, ensuring seamless interface management with higher-level system layers.
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Senior Physical Design Engineer
Enchargeai36
India
7mo
Lead physical implementation of complex silicon blocks from synthesis to sign-off, optimizing Power, Performance, and Area (PPA) for edge-to-cloud AI hardware.
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Principal Physical Design Engineer (RTL-to-GDSII)
Enchargeai36
India
7mo
Lead full-flow physical design implementation for massive, high-speed blocks and SoCs, transforming RTL into GDSII while optimizing PPA and eliminating systemic bottlenecks.
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Electrical Engineer
Cerebras
Headquarters/Sunnyvale Office
$150k–$150k
7mo
Lead printed circuit board design and electrical specification for Cerebras' world's largest AI chip, enabling ultra-high-speed AI training and inference.
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Sr Principal Design Engineer
Cadence
PUNE 04, IN
7mo
Owns full DFT lifecycle for high-speed, low-power chip designs, defining test architecture and implementing RTL changes to ensure testability and timing closure.
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STA Synthesis Engineer
Samsung Electronics
SSIR, Goldstone, Bangalore, India
7mo
Own timing constraints and drive timing closure for image sensor full chip and sub-system levels, including pre/post-layout analysis and ECO generation.
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Application Engineer- Prototyping
Siemens-Eda
Bangalore, IND, India
7mo
Deploy FPGA prototyping software and hardware solutions at customer sites, guide design bring-up, and collaborate with R&D to solve problems and improve product methodology.
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Digital Design Engineer
Texas Instruments
Bengaluru, Karnataka, India
7mo
Design and development of digital logic circuits, signal chains, clocking, and memory management for highly complex mixed-signal audio devices.
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Staff Digital Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
7mo
Lead digital design architecture, RTL, low power design, synthesis, and timing analysis for power management chips including DC-DC PMIC, multiphase controllers, and LED drivers.
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Principal Digital Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
7mo
Lead digital design architecture, RTL, low power design, synthesis, and timing analysis for power management chips serving consumer, industrial, and automotive applications.
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Sr Principal Digital Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
7mo
Sr. Principal Digital Design Engineer developing Power Management ICs (LED drivers, SiC drivers, smart-Switches, efuses) for consumer, industrial, and automotive applications.
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Computing System Architecture Engineer (Memory System Model and Optimization)
MediaTek
HsinChu
7mo
Designing memory subsystems and interconnects for smartphones, automotive, HPC, and data centers, with a focus on system-level SW/HW behavioral power/performance analysis and optimization.
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HSIO architect
MediaTek
HsinChu
7mo
Designing PC south bridge and USB host chipsets while ensuring compliance with HSIO specifications.
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NAND BM IP RTL Design Engineer
Samsung Electronics
7mo
Designing high-performance RTL for Samsung Memory products (Flash, DRAM) with a focus on concept study, specification, and micro-architecture.
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Principal Design Engineer
Cadence
BANGALORE
7mo
Designing high-performance physical IP for industry-standard protocols, covering digital architecture, RTL, low-power design, and synthesis for SerDes portfolios.
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Physical Design Engineer - Foundry Team
Samsung Electronics
SSIR, Goldstone, Bangalore, India
7mo
Physical design and timing closure for complex System-on-Chip (SoC) top-level implementations in mobile application processors, modem sub-systems, and connectivity chips.
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Director - Silicon Logical Design
Axelera
Remote
7mo
Lead and scale the digital design organization to architect, implement, and integrate complex AI accelerator SoCs from specification through tape-out.
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Principal Memory Design Engineer/Senior Technical Manager
MediaTek
San Jose, CA
7mo
Architecting and defining high-performance memory circuits for Data Center AI, Networking, and Edge AI ASIC solutions.
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Emulation Hardware Project Manager
Siemens-Eda
Remote
$130k–$130k
7mo
Planning, coordinating, and delivering emulation hardware support projects across engineering, IT, facilities, and vendor teams to ensure emulation platforms are deployed, maintained, upgraded, and supported on schedule.
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Staff Engineer, GPU Architect
Samsung Electronics
3655 N 1st St, San Jose, CA, USA
$151k–$151k
7mo
Designing next-generation GPU architectures for Samsung's Exynos chipset to enable high-performance, power-efficient graphics for mobile, automotive, and custom markets.
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DFT STA Lead
MediaTek
Bangalore
7mo
End-to-end DFT STA including SDC creation, sanity checks, CCD, CTS cleanup, and all-mode timing closure for top and block levels.
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<Data center>AI ASIC System Hardware Design Engineer
MediaTek
HsinChu
7mo
Design and develop AI system hardware including circuit design, component evaluation, selection, and customized component planning.
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Senior STA Lead
MediaTek
Singapore
7mo
Lead static timing analysis (STA) strategy and execution for advanced 3GHz+ CPU projects, ensuring first-time-right silicon sign-off.
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Senior ASIC Design Engineer
Nxp
Pune
8mo
Designing wireless MAC controllers and system-level development for next-generation IoT connectivity chips.
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Senior Hardware ASIC Arch/Design Engineer
Nxp
Hyderabad
8mo
Define architecture for compute, memory, interconnect, and high-speed interface subsystems in AI inference chips, leading PPA analysis and HW-SW co-design for real-world AI workloads.
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Senior Principal Digital IC Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Architect, specify, implement, simulate, and benchmark embedded MCU/DSP systems and hardware accelerators for semiconductor products.
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Staff Physical Design Engineer
Analogdevices
CLOSED-India, Bangalore, Aveda Meta
8mo
Own end-to-end physical implementation (floorplanning, power planning, placement, CTS, routing, ECO) for complex blocks or subsystems across advanced technology nodes (e.g., 22nm, 16nm, 7nm, 5nm, 4nm) and lead a small group of engineers to achieve…
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Senior Physical Design Engineer
NVIDIA
Israel, Yokneam
8mo
Design high-speed communication chips by performing physical design of blocks under constraints to optimize power, area, and performance.
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Sr Principal ASIC / RTL Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Senior Principal Digital Design Engineer developing power management products (DC-DC PMIC, controllers, SiC drivers) for consumer, industrial, and automotive applications.
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Principal ASIC / RTL Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Leading digital design architecture and RTL implementation for power management ICs including DC-DC PMIC, multiphase controllers, and SiC drivers.
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Principal ASIC Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Lead the micro-architecture, implementation, and verification of a digital sub-system within the Treo platform, a high-performance analog and mixed-signal solution for automotive, medical, industrial, and AI data center markets.
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Senior Physical Design Engineer - Signoff Methodology
Cisco
Armenia
8mo
Develop and refine backend methodologies and flows from RTL to GDS, focusing on signoff disciplines for high-quality VLSI designs.
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Digital Design Engineer (New Grad)
Monolithicpower
Taipei - Taiwan
8mo
Design, development, and verification of digital and mixed-signal integrated circuits (ICs) for power management and portable/non-portable markets.
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Datacenter GPU Power Architect
NVIDIA
US, CA, Santa Clara
$116k–$116k
8mo
Develop state-of-the-art GPUs and power estimation models to deliver exceptional performance-per-watt solutions for AI, HPC, Automotive, GeForce, and Mobile products.
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Senior VLSI CAD and AI Automation Engineer
NVIDIA
Israel, Yokneam
8mo
Developing and integrating advanced CAD solutions and automation flows using AI and machine learning for VLSI design, verification, and implementation.
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Senior Digital Design Engineer
MediaTek
Cairo
8mo
Architecting, designing, and integrating PHY IP blocks for high-speed interfaces within System-on-Chip (SoC) solutions.
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Digital Design Engineer
MediaTek
Cairo
8mo
Architecture, RTL design, and integration of PHY IP blocks for SerDes and high-speed interface IP within SoCs.
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Staff Design Engineer - Video
Arm
Multiple locations
9mo
Design and test hardware modules for Image Signal Processors (ISPs), Display Processors, and Video codecs within Arm Compute Subsystems.
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Digital Design Engineer
Texas Instruments
Bengaluru, Karnataka, India
9mo
Design and implementation of digital logic at the RTL level for ASICs or SoCs from specification to tape-out.
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HSI IP development engineer
MediaTek
Taipei
9mo
Developing and integrating third-party High-Speed Interface (HSI) Intellectual Property (IP) for PCIe, UCIE, and USB4 standards.
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Principal Engineer, STA & Synthesis
Renesas-Electronics
Hyderabad, in
9mo
Own synthesis and timing closure sign-off for low-power, chiplet-based MCU designs on cost-optimized mature process nodes.
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Digital Design Engineer Lead (DDR5 SPD Hub)
Monolithicpower
Chengdu - China
9mo
Lead the design development, implementation, and verification of digital logic for DDR5 SPD Hub (Serial Presence Detect Hub) including register interface, control logic, security features, and I3C/I²C communication modules.
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IC Design Engineer
Silabs
Singapore
9mo
Designing digital blocks and integrating them into highly integrated mixed-signal SoCs for low-power MCU and Wireless products.
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<Data center>Senior Design Engineer - Die-to-Die Interface
MediaTek
Taipei
9mo
Develop Die-to-die and UCIe digital IP for High-Performance Computing (HPC) System-on-Chip (SOC) and integrate controllers with PHYs.
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RTL Design for Data Center Chassis
MediaTek
San Jose, CA
9mo
Architecting, adopting, and designing chip/chiplet chassis building blocks for data center silicon.
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