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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,421 open positions
RTL Design for Data Center Chassis
MediaTek
San Jose, CA
9mo
Architecting, adopting, and designing chip/chiplet chassis building blocks for data center silicon.
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<Data center>Senior D2D Architect
MediaTek
Taipei
9mo
Designing and optimizing die-to-die and chip-to-chip communication architectures for performance, area, power, security, and resiliency.
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Digital Designer_HsinChu
MediaTek
HsinChu
9mo
Designing Wi-Fi architecture, digital circuits, and SoC integration from RTL to gate level with a focus on low power and timing closure.
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Principal Real Time Interconnect Architect
Arm
Multiple locations
9mo
Lead the definition and demonstration of Quality of Service (QoS) capabilities across Arm's IP portfolio and systems to ensure real-time predictability, power management, and performance.
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Semiconductor Digital Architect, Texas Institute for Electronics
Utaustin
AUSTIN, TX, US
10mo
Develop next-generation digital subsystems and compute fabrics for 2.5D/3D microsystems, enabling scalable, high-bandwidth integration across AI, HPC, and wireless acceleration platforms.
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Staff Logic Design Engineer
Flir
US - Milpitas, CA
$142k–$142k
10mo
Architect and implement high-performance digital logic for protocol capture, analysis, and emulation in FPGA-based systems.
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Senior RTL Design Engineer
Cisco
Armenia
10mo
Senior RTL Design Engineer driving next-generation silicon architecture development, defining Physical Design methodologies, and leading sub-system/SoC integration for advanced ASICs.
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Lead RTL Design Engineer
Cerebras
Headquarters/Sunnyvale Office
$175k–$175k
10mo
Lead RTL design engineer developing the Cerebras Wafer Scale Engine (WSE) architecture for high-performance AI training and inference.
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Lead Architect, Custom Silicon
GlobalFoundries
USA - Texas - Richardson
$132k–$132k
10mo
Define and drive the architecture of next-generation custom silicon solutions, including complex ASICs and SoCs, from concept through tape-out.
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CPU Physical Design Engineer_HsinChu
MediaTek
HsinChu
11mo
Deliver highly competitive ARM based CPU IP.
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System Performance Analysis Engineer
Arm
Sophia Antipolis, France
11mo
Investigate performance bottlenecks and optimize future Arm-based System-on-Chips (SoCs) by analyzing CPU, interconnect, memory, and I/O interactions in pre-silicon environments.
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SOC IP RTL Development Engineer
Samsung Electronics
11mo
Designing high-speed serial interface IP blocks for System LSI and Mobile SoCs.
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STA Lead Engineer
Samsung Electronics
11mo
Lead Static Timing Analysis (STA) engineer responsible for timing closure, constraint management, and mentoring teams in ASIC development.
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Lead SOC RTL Design Engineer
Samsung Electronics
11mo
Lead RTL design and architecture for SoC subsystems and IP blocks, managing front-end design tasks and leading engineering teams.
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Physical Design Engineer - SOC
Samsung Electronics
SSIR, Goldstone, Bangalore, India
11mo
Physical design and timing closure for complex System-on-Chip (SOC) top-level implementations in mobile application processors, modem sub-systems, and connectivity chips.
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Staff SOC Modeling Engineer
Arm
Bengaluru, India
1y
Develop high-performance functional models of Arm system-level IP and CPUs to enable early software development and architecture exploration before silicon availability.
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Senior/Principal Engineer – GPU Modeling / GPU Architect
MediaTek
San Diego, CA
1y
Define and develop best-in-class GPU architecture and performance/power models for next-generation MediaTek SoCs, analyzing workloads to guide micro-architecture decisions.
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Sr Principal Design Engineer
Cadence
BANGALORE
1y
Design, implement, and verify RTL for PCIe controllers and related subsystems, ensuring protocol compliance and performance targets.
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Electrical/Optical SerDes DSP and Algorithm Engineer
MediaTek
Irvine, CA
1y
Developing advanced algorithms and architectures for high-speed electrical and optical SerDes, with a focus on performance evaluation and optimization for power, performance, and area (PPA).
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Research Associate (IC Design)
Ntu
NTU Main Campus, Singapore
1y
Integrate Hardware AES and ASCON accelerators into the RISC-V CVA6 core, including custom instruction definition, toolchain modification, and verification.
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STA Lead Engineer
MediaTek
Bangalore
1y
Ensures timing closure for multi-mode, multi-voltage SoC and subsystem designs through full STA cycle management from constraints to GDS sign-off.
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Senior Chip Design Engineer
NVIDIA
Israel, Tel Aviv
1y
Design and implement next-generation high-speed Switch Silicon chips, focusing on RTL units and blocks to deliver high throughput and low latency.
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Synthesis Engineer
MediaTek
Bangalore
1y
Setting up synthesis environments, optimizing area and power for specific process nodes, and resolving timing and congestion violations in digital IC design.
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<Data center>Serdes System Design Engineer
MediaTek
HsinChu
1y
High-speed SerDes development, verification, and customer support for architecture, firmware, debugging, optimization, and testing.
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STA Engineer
MediaTek
Bangalore
1y
Setting up and executing Static Timing Analysis (STA) environments for multi-voltage domains to achieve timing closure and ensure quality handoffs for physical design.
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Sr. Staff Digital DE
Monolithicpower
Chengdu - China
1y
Leads end-to-end design and development of digital and mixed-signal ICs for power management, signal management, and mixed-signal functions.
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Physical Design Engineer
Etched
San Jose
1y
Own block-level implementation and verification, drive timing closure and PPA optimization for ASIC infrastructure focused on inference workloads.
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Research Associate/Engineer II (FPGA Design and Development)
Ntu
NTU Main Campus, Singapore
1y
Research and development of secure intelligent computing platforms using chiplet-based architectures and FPGA hardware.
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Research Fellow/Senior Research Fellow (Front-end design (RTL) Scientist for Heterogeneous Systems)
Ntu
NTU Main Campus, Singapore
1y
Research and development of secure, intelligent computing platforms using chiplet-based heterogeneous IC architectures.
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Senior FPGA Design/Verification Engineer
Lumentum
Canada - Ottawa (Bill Leathem)
1y
Design and verify control and datapath logic for next-generation optical switches and amplifiers in high-speed data transmission systems.
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SOC DFT Engineer
MediaTek
Hefei
1y
Define SOC chip-level and sub-system level DFT architecture, manage scan insertion and timing constraints, and support post-silicon diagnosis and manufacturing process (MP) issues.
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[MSL/SPD5] Senior/Staff Physical Design Engineer
MediaTek
Singapore
1y
Implementing top-quality digital backend design for advanced process chips (6nm/4nm/3nm and below) from RTL to GDS, serving the semiconductor industry.
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SerDes System Development Engineer
MediaTek
HsinChu
1y
High-speed SerDes development including firmware design, algorithm implementation, IC functional verification, and system performance optimization.
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Principal Engineer, Performance Modelling
Renesas-Electronics
Remote
1y
Develop and maintain performance models for System-on-Chip (SoC) designs using Platform Architect or Emulation Platform to optimize performance and ensure successful product delivery.
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RTL Design Engineer
Etched
San Jose
1y
Develop and implement design verification strategies for AI chips (ASICs) focused on inference workloads, ensuring correct and efficient operation of high-speed digital logic blocks.
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Sr Principal Application Engineer
Cadence
NOIDA
1y
Technical leadership for FPGA-based hardware emulation and prototyping solutions, bridging customers, sales, and R&D to secure design wins.
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STA methodology engineer
Nxp
Bangalore
1y
Benchmark logic libraries across advanced technology nodes (40nm to 5nm) using synthesis and PNR flows to ensure robust STA methodologies for real-world chips and blocks.
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<Data center>HBM Memory Digital IC Design Engineer
MediaTek
HsinChu
1y
Develop and implement DRAM controller/PHY solutions for data-center applications, optimizing performance, power, latency, and efficiency.
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Principal Design Engineer
Cadence
1y
Architect and design state-of-the-art DDR memory controllers for Datacenter, Edge, Automotive, and AI applications.
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Lead Design Engineer
Cadence
PUNE
1y
Digital design implementation and PPA optimization of state-of-the-art Cadence IPs for advanced process nodes (7nm/5nm/3nm/2nm) using EDA tools.
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Principal Design Engineer
Cadence
PUNE
1y
Develop cycle-level performance models and architectural tradeoff analysis for next-generation DDR memory controller architectures to support complex SoC and workload requirements.
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Sr Design Engineering Architect
Cadence
BANGALORE
1y
Architecting and developing RTL for PCIe/CXL/IDE/UALink interface controller IP, including CPU, memory, IO, and cache subsystems.
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Modem CPU Digital Design Engineer(5G/6G)
MediaTek
HsinChu
2y
Design 5G and next-generation modem processors optimized for system performance, low power, and high speed.
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Sr. Engineer_ChuPei
MediaTek
ChuPei
2y
Physical design implementation for advanced process nodes (7nm to 3nm), covering floorplanning, timing closure, and sign-off.
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<Data center>Mixed-Signal Digital IC Design Engineer(Serdes, HS Interface)
MediaTek
HsinChu
2y
Designing and integrating Serdes PMA IP architecture, RTL, and verification for high-speed interfaces.
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<Data center>Digital IC Design Engineer_Taipei (SOC BE)
MediaTek
Taipei
2y
Improving digital IC design backend flow and executing tasks to optimize Performance, Power, and Area (PPA) for SOC chips.
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Digital IC Design Engineer_ChuPei
MediaTek
ChuPei
2y
Architecture design, digital circuit design, RTL implementation, verification, and SoC chip integration from RTL to gate level.
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SoC Physical Design Engineer
MediaTek
HsinChu
2y
Implementing SoC designs at 3~7nm nodes, managing the full physical design flow from synthesis to sign-off.
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Platform Technology Development
MediaTek
HsinChu
2y
Develop systematic methodologies for chip design including FIP development, synthesis, DFT, physical implementation, and sign-off in advanced nodes or packages.
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<Data center>Digital IC Integration Technical Manager_Hsinchu/Taipei
MediaTek
HsinChu
2y
Leading SoC chip integration from RTL to gate level, ensuring timing closure, testability, and design methodology improvements.
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