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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,421 open positions
IP RTL Senior Design Engineer
Intel
India, Bangalore
2mo
Develop high-quality intellectual property (IP) logic designs, register transfer level (RTL) coding, and simulations for Unified Intel Chassis designs, focusing on protocol bridges, access control, and reliability features.
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Senior Principal Engineer, Hardware Application Engineering - Board & System Design
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I8is Inc.
Santa Clara, CA, US
$200k–$200k
2mo
Senior technical authority guiding complex board and system hardware designs for advanced networking and AI infrastructure platforms, ensuring optimization for performance, reliability, and high-volume production.
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Principal Technical Program Manager – DSP/Mixed-Signal ASIC Development – TeraWave
Blueorigin
San Diego, CA
$249k–$249k
2mo
Lead end-to-end development of advanced mixed-signal/DSP ASICs and SoCs (including Digital Beamforming) for TeraWave's satellite communication system, spanning architecture definition through production.
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Chip Design Engineer
NVIDIA
Israel, Tel Aviv
2mo
Design, implement, and verify next-generation high-speed Switch Silicon chips focusing on power, area, and performance.
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Senior CPO System Hardware Engineer
NVIDIA
Israel, Raanana
2mo
Lead system architecture and design for CPO (Co Package Optic) switches enabling optimized end-to-end GPU connectivity in NVIDIA next-generation data centers.
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Staff Physical Design Engineer - SoC EMIR Engineer
Asteralabs
Tel Aviv
2mo
Backend power methodologies and EMIR analysis for high-performance SoCs in advanced FinFET nodes to ensure power robustness and reliability for AI clusters.
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HBM Logic Architect
Skhynixamerica
San Jose, CA
$150k–$150k
2mo
Establishing US-based HBM Architect Design team to address base-die architectural challenges in HBM and 3D-stacked DRAM for key customers.
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Senior Physical Design Engineer
Microsoft
United States, Oregon, Hillsboro
2mo
Own complete physical design execution for medium to large-size SOC blocks, driving end-to-end flow from synthesis through place-and-route and all signoff stages.
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Technical Chief of Staff for ASIC Engineering
Asteralabs
San Jose
$216k–$216k
2mo
Chief of Staff to Head of Engineering leading ASIC tape-out management and program execution for rack-scale AI infrastructure.
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Principal Architect
Asteralabs
Haifa
2mo
Lead architecture for high-performance connectivity solutions at the intersection of silicon, system, and protocol design for AI infrastructure.
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Senior Principal Digital Design Engineer
Asteralabs
San Jose
$205k–$205k
2mo
Define micro-architecture strategies and lead RTL implementation for next-generation digital designs powering AI infrastructure connectivity.
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Tech Lead Physical Design Engineer, Power Integrity
Asteralabs
San Jose
$160k–$160k
2mo
Own IR drop and electromigration (IR/EMIR) analysis and closure across connectivity ASIC portfolio from floorplan to tapeout to ensure stable power delivery.
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Physical Design Student
Asteralabs
Haifa
2mo
Support the physical implementation journey for complex semiconductor chips solving data bottlenecks for AI at scale.
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Director, Physical Design
Asteralabs
Hyderabad
2mo
Lead and build a high-performing Physical Design team in Hyderabad to drive silicon success for complex, high-speed connectivity ASICs from RTL to GDSII.
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Principal Digital Design Engineer
Asteralabs
San Jose
$185k–$230k
2mo
Architect and implement next-generation digital designs for high-performance AI connectivity solutions, owning complex blocks from micro-architecture through silicon bring-up.
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Principal Physical Design Engineer, STA
Asteralabs
San Jose
$209k–$209k
2mo
Drive end-to-end static timing analysis (STA) ownership for complex SoCs to ensure robust full-chip timing convergence for connectivity ASICs.
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Senior ASIC Design Engineer
Asteralabs
Israel
2mo
Designing digital blocks for high-performance AI infrastructure connectivity chips, owning the journey from high-level definition through RTL implementation and backend support.
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Physical Design Engineering, VP
Asteralabs
San Jose
$251k–$251k
2mo
Lead end-to-end physical design execution for complex multi-die switching products featuring UCIe and UALink connectivity to enable rack-scale AI infrastructure.
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Principal Physical Design Engineer, Methodology
Asteralabs
San Jose
$185k–$185k
2mo
Define, develop, and maintain reusable physical design flows and automation infrastructure for the entire Physical Design (PD) team to enable faster, better tapeouts of complex SoCs.
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Staff/ Principal Physical Design CAD Engineer
Asteralabs
Haifa
2mo
Develop and maintain physical design CAD flows and automation infrastructure for high-speed semiconductor chips powering large AI clusters, ensuring precision from RTL to GDSII.
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Staff/ Principal Physical Design Engineer - SoC EMIR Expert
Asteralabs
Haifa
2mo
Backend power methodologies and SoC EMIR analysis to ensure power robustness and reliability for high-performance AI connectivity silicon.
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Chip Lead, Senior Director
Asteralabs
Israel
2mo
Drive end-to-end success of next-generation UALink switching products for rack-scale AI and hyperscale data centers.
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Staff/ Principal Physical Design STA Engineer
Asteralabs
Israel
2mo
Execute Static Timing Analysis (STA) flow and sign-off methodologies for complex semiconductor chips enabling rack-scale AI infrastructure.
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Technical Lead Physical Design Engineer
Asteralabs
Toronto
$140k–$140k
2mo
Drive end-to-end static timing analysis (STA) ownership and timing closure for complex SoCs in connectivity ASICs.
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Silicon Technical Program Manager
Asteralabs
Tel Aviv
2mo
Architecting the operational reality and physical implementation strategy for complex semiconductor chips that solve data bottlenecks for large-scale AI clusters.
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Senior Principal Engineering Program Manager
Asteralabs
San Jose
$205k–$205k
2mo
Lead end-to-end execution of advanced-node ASIC products from concept through production, ensuring revenue-critical silicon delivery on time, on spec, and at scale.
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Principal Electrical Engineer – Smart Cable Modules
Asteralabs
Shanghai
2mo
Define and own the end-to-end electrical architecture for next-generation active copper cable assemblies and pluggable modules (OSFP, QSFP-DD) targeting 400G, 800G, and beyond for data center AI/ML fabric and high-performance computing.
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Expert IC Package Design Lead
Asteralabs
Tel Aviv
2mo
Lead physical implementation strategy for advanced IC packaging solutions enabling high-performance connectivity silicon for AI clusters.
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DFT Engineer
Asteralabs
Israel
2mo
Design and implement Design-for-Testability (DFT) architectures and strategies for next-generation AI connectivity chips to ensure silicon reliability and testability.
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PCB Layout Engineer
Tenstorrent
Santa Clara
$100k–$100k
2mo
Designing multi-layer PCB layouts for high-performance computing and AI hardware, ensuring signal integrity and manufacturability for mass production.
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Principal Silicon Systems Architect
Microsoft
United States, Washington, Redmond
2mo
Lead silicon roadmap definition and system architecture for key compute pillars like AI or system memory, translating workloads and product goals into technical requirements.
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Principal Physical Design Engineer
Microsoft
United States, California, Mountain View
2mo
Lead and execute Physical Design activities at block, sub-chip, and full-chip levels, contributing to flow development, automation, and methodology improvements.
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Silicon Engineer II
Microsoft
India, Karnataka, Bangalore
2mo
Own execution from synthesis to place and route, including timing signoff, physical verification, EMIR, formal equivalence, and low power verification for design partitions.
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Systems Architect
Ambiqmicroinc
Singapore
2mo
Define high-level architecture for Ambiq's low-power System-on-Chips (SoCs), focusing on subsystems and interfaces for audio, imaging, display, and high-speed links to enable ubiquitous AI at the edge.
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Staff Engineer, FPGA Design (R5347)
Shieldai
Seattle, Washington
2mo
Designing, implementing, verifying, and debugging FPGA-based solutions for complex avionics in Unmanned Aerial Vehicles (UAV).
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AI/ML driven ASIC Design and Implementation Automation Engineer
Nxp
Bangalore
2mo
Develop prototype AI/ML solutions to improve efficiency and quality (power, performance, area, verification) for SoC and IP development flows.
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AI/ML driven ASIC Design and Implementation Lead Engineer
Nxp
Bangalore
2mo
Lead engineer exploring and implementing AI/ML techniques to improve efficiency, power, performance, and area for SoC and IP development flows.
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Senior Full Chip Layout and Physical Verification CAD Engineer
NVIDIA
Israel, Yokneam
2mo
Developing full-chip physical design methodologies and physical verification flows for high-speed networking chips and SOCs.
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Sr. Principal Digital Designer
Nxp
Bangalore
2mo
Lead the architecture, implementation, and integration of digital subsystems for Automotive Ethernet PHY products, including PCS pipelines, encoding/decoding logic, and safety mechanisms.
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ASIC Design Engineer Technical Lead
Cisco
San Jose, California, US
$187k–$187k
2mo
Lead ASIC design for Cisco's core Switching, Routing, and Wireless products, defining architecture and implementing RTL to power AI-era hardware platforms.
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Senior Manager, System Co-Design Manager - SCG Team
NVIDIA
US, CA, Santa Clara
$232k–$232k
2mo
Lead Product Co-Design and Verification for Speed, Reliability, and Power Compliance in semiconductor design, translating product requirements into silicon solutions.
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FPGA Lead/Architect/Implementor
Flir
Denmark - Kongens Lyngby
2mo
Lead the architecture, design, and implementation of next-generation ultra-high-speed Ethernet test platforms supporting IEEE802.3dj and Ultra Ethernet standards.
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Sr Principal HW Design Engineer/HW Architect
Cadence
SAN JOSE
$179k–$179k
2mo
Architect and design hardware system platforms for emulation-acceleration technologies, managing board-level design, schematic entry, PCB layout, and signal integrity.
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Hardware Engineer II
Apcon
Headquarters
2mo
Designing physical electronics for network visibility and switching products, including embedded processors, switch ASICs, and high-speed digital circuitry.
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Senior Design Engineer - IP Office
Microsoft
United States, California, Mountain View
$120k–$120k
2mo
Lead IP selection, qualification, acquisition, and integration for AI SoC programs, ensuring alignment with product requirements and SoC landing zones.
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Principal AI Silicon Architect
Microsoft
United States, California, Mountain View
2mo
Define high-performance AI silicon architecture specifications and functional/analytical models for AI core compute blocks to support current and future AI models.
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Senior Silicon Design Engineer
Microsoft
United States, Washington, Redmond
2mo
Design high-performance, high-bandwidth Network-on-Chip (NoC) architectures and RTL for start-of-the-art AI SoCs.
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IC Digital Design Engineer
Aumovio
Bengaluru, KA, in
2mo
Architect, design, and verify complex digital front-end circuits and systems for FPGA and ASIC implementations.
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ASIC Engineer, Architecture
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Meta
Austin, TX, US
$114k–$114k
2mo
Define and drive architectural performance analysis, pre-silicon modeling, and microarchitectural exploration for custom ASICs powering Meta's AI and data center workloads.
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ASIC Engineering Technical Leader
Cisco
Taipei, Taiwan
2mo
Define, design, and verify high-performance ASICs and subsystems for Cisco networking platforms (routers, switches, optical), focusing on power, performance, and area goals.
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