Principal Technical Program Manager – DSP/Mixed-Signal ASIC Development – TeraWave
Core
Lead end-to-end development of advanced mixed-signal/DSP ASICs and SoCs (including Digital Beamforming) for TeraWave's satellite communication system, spanning architecture definition through production.
Role type
Principal Technical Program Manager (Semiconductor/ASIC)
Builds
High-performance SoCs managing multiple signal chains (bits to antennas) including SERDES and high-speed ADC/DAC interfaces for satellite constellations.
Domain
Aerospace / Satellite Communications / Mixed-Signal ASIC Design
Deliverable
production ML models | product features
Required skills
Technical program management, mixed-signal/DSP ASIC/SoC ownership, IP selection and management, foundry engagement, critical-path scheduling, technical risk management, multi-disciplinary team coordination.
Preferred skills
High-speed SERDES integration, high-sample-rate ADC/DAC interfaces, digital beamforming architectures, phased-array antenna systems, radiation/reliability features, advanced-node design flows.
Technologies
7nm and below process nodes, RTL design, verification, physical implementation, tapeout, CAD infrastructure.
Responsibilities
Drive MS/DSP SoC development from architecture freeze to production; Build and maintain integrated schedules across internal and external teams; Coordinate resolution of critical architecture trades (hybrid vs. full digital beamforming, SERDES, ADC/DAC config); Track and mitigate technical risks (power budget, IP maturity, legal pipelines); Align DSP requirements between FEIC, Modem, and system-level teams; Manage design services partners and IP vendors; Monitor critical path milestones through tapeout and first silicon bring-up; Support power, area, and cost optimization trades; Oversee post-silicon development phases (bring-up, validation, qualification, production ramp).
Seniority
Principal, hands-on IC
