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Principal Electrical Engineer – Smart Cable Modules

Shanghai💼 Full-time🗓 2026-07-28 → 2026-09-26

Core

Define and own the end-to-end electrical architecture for next-generation active copper cable assemblies and pluggable modules (OSFP, QSFP-DD) targeting 400G, 800G, and beyond for data center AI/ML fabric and high-performance computing.

Role type

Principal Electrical Engineer (Hardware Architecture & Design)

Builds

Smart Cable Modules (SCM) and pluggable modules for hyperscale AI infrastructure

Domain

Data Center Networking / High-Speed Interconnect / AI Infrastructure

Deliverable

production ML models | product features

Required skills

High-speed SerDes architecture (112G PAM4, 56G NRZ), Signal Integrity (SI) & Power Integrity (PI) design, PCB layout for multi-layer modules, Power Delivery Network (PDN) design, Mixed-signal circuit design, Hardware bring-up & debug, MSA specifications (OSFP, QSFP-DD), EDA tools (Cadence Allegro/OrCAD), Component selection & supplier engineering

Preferred skills

800G+ module architecture, Co-packaged optics (CPO) or Linear Drive (LPO), Host-side switching ASIC interfaces, Python scripting for lab automation

Technologies

OSFP, QSFP-DD, SerDes, I2C, MDIO, Cadence Allegro, OrCAD, Python

Responsibilities

Define electrical architecture including SerDes topology, power delivery, and thermal budgeting; Establish internal electrical design standards and SI/PI guidelines; Lead technical reviews and provide sign-off on high-speed digital designs; Drive schematic capture and PCB design for complex multi-layer modules; Own power delivery design including multi-rail regulation and hot-plug sequencing; Author hardware bring-up strategies and lead root-cause analysis on hardware failures; Mentor senior and mid-level engineers in high-speed design.

Seniority

Principal, strategic ownership & technical leadership

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