Principal Architect
Core
Lead architecture for high-performance connectivity solutions at the intersection of silicon, system, and protocol design for AI infrastructure.
Role type
Principal Architect (Hardware/Connectivity)
Builds
Next-generation AI infrastructure systems with high-bandwidth, low-latency connectivity
Domain
Semiconductor hardware, high-speed networking, AI infrastructure
Deliverable
production ML models
Required skills
PCIe architecture (Gen4/5/6+), high-speed networking and Ethernet (25G/50G/100G/400G+), SoC architecture, chip development lifecycle, tradeoff analysis (performance/power/latency/area/cost), cross-functional collaboration, performance modeling and simulation
Preferred skills
CXL, NVLink, UALink, AI/ML infrastructure, data center systems, hyperscaler environments, SerDes-based systems, high-speed PHY integration, networking stacks, switching, RDMA, power/performance optimization
Technologies
CXL, NVLink, UALink, PCIe, Ethernet, SerDes, RDMA
Responsibilities
Define and drive system and chip-level architecture for high-speed connectivity products; Lead architecture for PCIe-based interconnects, networking protocols, and Ethernet subsystems; Analyze system requirements and translate them into scalable and efficient hardware architectures; Drive tradeoff analysis across performance, power, latency, area, and cost; Collaborate with cross-functional teams including RTL, Physical Design, Firmware, Validation, and Product Engineering; Define and review micro-architecture specifications and ensure alignment across teams; Mentor engineers and help build strong technical leadership within the Israel R&D center
Seniority
Principal, hands-on IC with strategic influence
