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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
2,685 open positions
Principal Physical Design CAD Engineer
Asteralabs
Haifa
9d
Develop, maintain, and improve CAD flows and methodologies for physical design teams, supporting advanced implementation stages from synthesis through place and route, timing closure, power optimization, and signoff readiness.
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Staff / Principal ASIC Design Engineer
Asteralabs
Haifa
9d
Designing digital blocks for high-performance AI infrastructure connectivity chips (CXL, Ethernet, NVLink, PCIe, UALink) in deep-submicron processes.
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Staff Physical Design Engineer - SoC EMIR Engineer
Asteralabs
Tel Aviv
9d
Backend power methodologies and EMIR analysis for high-performance SoCs enabling AI clusters.
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Senior/ Staff Physical Design Engineer
Asteralabs
Tel Aviv
9d
Architecting the physical implementation of complex semiconductor chips for AI infrastructure connectivity, transforming logic into high-performance silicon.
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Copy of Staff/ Principal Chip Top Physical Design Engineer
Asteralabs
Israel
9d
Execute SoC Top-level physical design and full-chip convergence for chips driving the world's largest AI clusters.
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Senior ASIC Design Engineer
Asteralabs
Israel
9d
Designing digital blocks for high-performance AI infrastructure connectivity chips, owning the journey from high-level definition through RTL implementation and backend support.
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CPU Performance Architect/Modelling , Senior/Staff - Cork, Ireland
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Qualcomm Innovation Center, Inc.
Cork, County Cork, Ireland
10d
Architect and design state-of-the-art CPUs focusing on performance, energy efficiency, and scalability; model advanced CPU performance features and collaborate with design teams to productize them.
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<GPU>Senior GPU Hardware Designer / GPU Digital Designer
MediaTek
HsinChu
10d
Design and implement GPU hardware modules, including microarchitecture design, RTL coding, functional integration, and design optimization.
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<GPU>GPU hardware design engineer
MediaTek
HsinChu
10d
Design and implement key GPU hardware blocks, including microarchitecture design, RTL implementation, integration, and optimization.
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FPGA Design Engineer- Cisco Silicon One
Cisco
Caesarea, Israel
10d
Lead FPGA design and development of complex systems for next-generation networking devices and AI infrastructure.
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Atom CPU Layout Design Engineer
Intel
Mexico, Guadalajara
10d
Physical implementation of next-generation high-performance Intel Atom microprocessors, focusing on memory compilers, custom IPs, and partitions.
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Senior SoC Architect
SEMRON GmbH
Dresden, DE (primary site) / Austin, TX
10d
Lead the development of digital architecture for SoC chiplets combining SRAM, DMA, CPUs, Vector Processors, Routers, and Chiplet Communication Units for SEMRON's CapRAM™ technology enabling LLM inference.
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AI Silicon Performance Modeling and Analysis Engineer
Intel
US, California, Santa Clara
11d
Develop and maintain performance models for next-generation AI silicon products to enable architecture exploration, design evaluation, scalability analysis, and performance projection.
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AI Silicon Performance Modeling and Analysis Engineer
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Intel Corporation
Santa Clara, CA, US
11d
Develop and maintain performance models for next-generation AI silicon products to enable architecture exploration, design evaluation, scalability analysis, and performance projection before silicon availability.
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Chief Memory Chip Design Engineer & Architect
Western-Digital
San Jose, CA, us
11d
Owns end-to-end product architecture for memory subsystems from concept through silicon qualification, acting as the final technical authority across design, process, and product engineering.
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Director of Physical Design
Ambiqmicroinc
Austin HQ
11d
Lead and scale the physical implementation organization for next-generation ultra-low-power microcontroller (MCU) products, driving the physical design roadmap to ensure world-class PPA (power, performance, area) and deliver robust silicon for high-volume…
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Senior Silicon Product Architect, Performance and Power
NVIDIA
US, CA, Santa Clara
12d
Define technical strategy for next-generation silicon products by connecting silicon capabilities, customer workloads, and system-level opportunities to achieve performance, power, and efficiency goals.
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Senior Power and Thermal Architect
NVIDIA
US, CA, Santa Clara
12d
Architect next-generation system, platform, and datacenter-level power and thermal co-design solutions to drive product differentiation across NVIDIA's roadmap.
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Architect
Delos Data
Palo Alto
$160k–$280k
12d
Define, architect, and guide the development of next-generation, high-performance ASICs for AI accelerators, networking, and datacenter computing workloads.
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Ingeniero/a FPGA junior
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Maxwell Applied Tech
Santiago de Compostela, Galicia, Spain
12d
Design, implement, and test FPGA modules for digital signal processing (DSP), high-speed communications, embedded software, and system-level integration.
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Principal Physical Design Engineer
Broadcom
USA-CA San Jose Innovation Drive
$144k
12d
Lead physical design implementation for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs, transforming ultra-complex architectures into high-yielding silicon.
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Senior Silicon Architect – Cache Coherent Interconnects
NVIDIA
US, CA, Santa Clara
$168k–$265k
12d
Own the silicon architecture and construction plan for next-generation CPU processors, focusing on dielet partitioning, packaging, die-stacking, and floorplanning.
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Physical Design Engineer
Apple
Cupertino, United States of America
12d
Physical Design Engineer responsible for full-chip physical design flow from RTL to GDSII delivery for high-performance PHY designs.
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NoC Interconnect Design Engineer and Architect
Qualcomm
San Diego, California, United States of America
$122k–$183k
12d
Design and architect NoC bus components and interconnects for SoCs, defining micro-architecture, analyzing performance/power tradeoffs, and delivering RTL.
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Graduate Engineer – Systems Engineering
Arm
Bristol, United Kingdom
12d
Develop and verify system-level hardware technologies for memory management, interconnects, and AI processing within next-generation Arm-based SoCs.
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Stage - Automatisation et optimisation de Flow de Conception FPGA f/h - Strategic Student Program
Siemens-Eda
Meudon, FRA, France
14k
12d
Accelerate FPGA implementation timelines by automating and optimizing design flows using AMD Vivado DFX functions.
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Sr. Staff Engineer, Physical Design
Marvell
VN - Da Nang
12d
Lead an experienced team of physical design and static timing analysis engineers to deliver backend design services for next-generation 5G, cloud, enterprise, and automotive SOC designs.
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Lead Product Engineer
Cadence
NOIDA, IN
12d
Lead Product Engineer performing static timing analysis, timing closure, and ECO for advanced SoCs using industry-standard tools.
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IC Design Engineer (STA/ Synthesis)
Broadcom
USA-CA San Jose Innovation Drive
$144k
12d
Lead STA/Synthesis engineer responsible for timing closure, constraint development, and validation of mission-critical IP and ASIC blocks in advanced technology nodes.
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ASIC Design - Floorplan Engineer
Broadcom
USA-Colorado-Fort Collins-4380 Ziegler Road
12d
Define and optimize top-level floorplan architecture, macro placement, power grid, and clock distribution for advanced CMOS ASICs operating at speeds exceeding 1 GHz.
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Physical Design Engineer
Broadcom
USA-CA San Jose Innovation Drive
$83k
12d
Execute block-level floorplanning, placement and route (P&R), timing closure, and physical verification for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs on leading-edge nodes (N5/N3/N2/A14).
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Physical Design Engineer
Broadcom
USA-CA San Jose Innovation Drive
$144k
12d
Physical Design Engineer responsible for ASIC/SoC design implementation, focusing on place and route, timing closure, and physical verification to achieve Right-first time silicon.
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Design Engineer
Altera
Bengaluru, Karnataka, India
12d
Design and verify complex digital circuits for FPGA and SoC products from concept to silicon.
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Senior Silicon Architect – Cache Coherent Interconnects
NVIDIA
US, CA, Santa Clara
$168k–$265k
12d
Design silicon architecture and construction plans for next-generation CPU processors, focusing on dielet partitioning, packaging, and die-stacking exploration.
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Senior Circuit Design Engineer
Cisco
Armenia
12d
Design, develop, and test advanced ASIC subsystems and reusable IP for high-performance networking silicon, focusing on power, performance, area, and reliability.
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Semiconductor Engineer (High-Speed Interfaces / Hardware Solutions)
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Marquee Semiconductor Singapore Pte. Ltd.
Geylang, S00, SG
12d
Architect and deliver high-speed hardware solutions including PCIe Gen5/6 CEM add-in cards, slot interposers with embedded FPGA, NVMe/SSD protocol-test platforms, and multi-variant Open VPX / VNX+ Single Board Computers (SBCs) for semiconductor, memory, test…
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Staff Engineer Design
Infineon
Bangalore BTP
12d
Design and implement high-performance WLAN MAC digital systems and subsystems for next-generation semiconductor products.
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Staff Engineer Design
Infineon
Bangalore BTP
12d
Design and develop high-performance WLAN MAC digital systems and modules for advanced wireless semiconductor products.
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ASIC Design Senior Staff Engineer
Qualcomm
Shanghai, China
12d
Drive architecture definition and technical strategy for next-generation Ethernet switch or PON ASICs, enabling scalable, high-performance networking solutions.
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NoC Interconnect Design Engineer and Architect
Qualcomm
Santa Clara, California, United States of America
$135k–$202k
12d
Define, model, design, optimize, verify, validate, implement, and document IP (block/SoC) development for high performance, high quality, low power products.
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HW Designer
Ericsson
Stockholm,Stockholm,Sweden
12d
Design and maintain board-level schematics for PCB/PBA products, integrating ASICs and FPGAs.
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Principal Physical Design Engineer, STA
Broadcom
USA-CA San Jose Innovation Drive
$144k
12d
Full-Chip Static Timing Analysis (STA) Engineer ensuring high-performance ASICs meet aggressive performance targets and tight timing requirements across all operating conditions.
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ASIC Design Engineer
Broadcom
USA-Colorado-Fort Collins-4380 Ziegler Road
$62k
12d
Physical design implementation of large-scale custom CMOS ASICs for AI, Cellular, Networking, Computing, and Storage products.
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Senior Staff Engineer, Physical Design
Marvell
Singapore
12d
Drive RTL-to-GDS implementation for next-generation processors and ASICs powering AI infrastructure, cloud data centers, and networking solutions.
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FPGA Design Engineer
Bakerhughes
IN-Maharashtra-Pune-7th Floor, Tower 1 & 2, Phoenix Millenium Towers S No. 132, 23. Pune-Bangalore Highway
12d
Design, verification, and testing of FPGA-based modules for real-time condition monitoring systems in the energy sector.
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Senior Staff Digital Design Engineer - Audio DSP Algorithm
Syntiant
Schweiz
12d
Design, implement, and verify DSP algorithms, interfaces, and protocols for audio processing on ASICs, supporting MEMS microphones and complex failure analyses.
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ASIC Engineer, Physical Design CAD
Meta
Bangalore, Karnataka
12d
Building and owning the physical design flow infrastructure (synthesis, place and route, timing closure) for custom AI and data center silicon.
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Lead FPGA Timing & Characterization Silicon Design Engineer
AMD
Hyderabad, Telangana
12d
Lead the development, validation, silicon correlation, and release of FPGA timing models to enable industry-leading FPGA implementation and timing analysis tools.
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Staff Engineer - DFT
Marvell Technology
Bangalore, Karnataka
12d
Design for Test (DFT) and Static Timing Analysis (STA) engineering for networking SoCs, covering timing constraints, testability strategy, and verification across copper and optical products.
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Solutions Architect-FPGA
Advanced Micro Devices, Inc
San Jose, California
12d
Architect and develop hardware/software co-design solutions for FPGA-based acceleration in networking, storage, automotive, aerospace, and AI/ML workloads.
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