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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
2,685 open positions
Sr. EMIR Analysis Engineer
Advanced Micro Devices, Inc
Bangalore, India
7d
Full chip SoC electrical signoff convergence with physical design engineers to achieve first pass silicon success.
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System Performance Engineer, Senior
Qualcomm
San Diego, California, United States of America
$130k–$194k
8d
Research, design, develop, simulate, and validate systems-level software, hardware, architecture, and algorithms to optimize power, performance, and thermal behavior of Qualcomm Snapdragon Chipsets.
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R&D Engineering, Principal Engineer
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Synopsys
KA, IN
8d
Principal Engineer responsible for timing signoff methodology, static timing analysis, and standard cell library development for advanced semiconductor nodes.
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Hardware Engineering Technical Leader
Cisco
Bangalore, India
8d
Hardware Engineering Technical Leader defining architecture, specifications, and standards for complex next-generation Cisco hardware products and systems.
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Master Thesis: Early Prediction and Optimization of power, Perfomance and Area
Ericsson
Lund,Skåne,Sweden
8d
Investigate how RTL characteristics and simulation data can improve early prediction of Power, Performance, and Area (PPA) for digital designs.
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FY27 Intern - Qualcomm SoC Engineering Internship - Canada (16 months)
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Qualcomm
Markham, ON, CA
8d
Develop next-generation Snapdragon mobile platforms and Data Center SoCs across RTL design, verification, physical design, power, and AI/ML development.
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Principal Engineer Verification
Infineon
Bangalore BTP
8d
Lead digital architecture and design for Power IC product families (Gate Drivers, DC-DC Converters, PoL) from concept to mass production.
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Staff/ Senior Backend (Physical Design) Engineer
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Amlogic Singapore Private Limited
Jurong Island, S00, SG
8d
Lead backend physical design tasks from netlist to GDSII, including floorplanning, P&R, timing analysis, and tape-out for advanced process nodes.
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Research And Development Engineer (FPGA)
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Uptec
Eindhoven Area
8d
Develop FPGA-based solutions for new high-tech machine applications, translating system requirements into digital architectures and designs.
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GPU Design Engineer – Memory Hierarchy
Apple
Santa Clara, United States of America
8d
Design and manufacture next-generation, high-performance, power-efficient processor and system-on-chip (SoC) with a focus on GPU memory hierarchy to support Apple products and services.
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Master Thesis: Early Prediction and Optimization of power, Perfomance and Area
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Ericsson
Lund, Skåne County, Sweden
8d
Investigate how RTL characteristics and simulation data can be combined to improve early Power, Performance, and Area (PPA) prediction for digital designs.
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Principal Engineer - FPGA/ASIC Design
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Rolls-Royce
Remote
8d
Design, verify, integrate, and test FPGA/ASIC solutions for Rolls-Royce engine control system products.
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Program Management Engineer
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Texas Instruments
KA, IN
8d
Drive planning, execution, and delivery of complex silicon IP-related programs spanning design, licensing, and cross-functional engineering initiatives across multiple IP domain verticals.
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SoC Product Architect, Memory Ecosystem
NVIDIA
US, CA, Santa Clara
$320k
8d
Define and align NVIDIA's external memory ecosystem (DRAM, non-volatile flash) with SoC and platform roadmaps to deliver industry-leading bandwidth, latency, power, and cost.
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ASIC Power Design Engineer II (Full Time) - United States
Cisco
San Jose, California, US
$112k–$203k
8d
Implement and optimize low-power design methodologies and perform power analysis/estimation for ASICs powering Cisco's core Switching, Routing, and Wireless products.
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Senior Engineer, SoC PnP Architect
Arm
Bengaluru, India
8d
Senior SoC PnP Architect responsible for system-level performance, power, and efficiency investigations across complex silicon platforms, bridging pre-silicon modeling, emulation, and post-silicon characterization.
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Technical Lead Digital Design Engineer
Asteralabs
San Jose
$160k–$200k
8d
Design and implement next-generation digital designs for high-performance connectivity solutions, covering micro-architecture through silicon bring-up.
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RTL Engineer
DensityAI
USA
$215k–$300k
8d
Designing digital blocks and subsystems for AI accelerators from microarchitecture definition through silicon implementation.
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Ingénieur FPGA / ASIC Numérique - Industrie - Toulouse
Sopra-Steria
Toulouse, Occitanie, fr
8d
Develop embedded and industrial systems with real-time and safety constraints, focusing on FPGA and ASIC digital circuit design.
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Concepteur.trice FPGA
Go RH
Montréal, Qc
8d
Design, develop, integrate, and validate FPGA solutions for innovative video processing and multimedia control systems.
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Spécialiste FPGA – Secteur Défense (H/F)
Alten
Cholet, Pays de la Loire, fr
8d
Design, development, and optimization of FPGA-based solutions for critical defense applications.
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Principal Timing Design Engineer
Renesas-Electronics
Kodaira, jp
8d
Lead backend timing and test design for next-generation semiconductor products serving IoT, automotive, and industrial markets.
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Senior PD Engineer - STA & Timing Closure
Advanced Micro Devices, Inc
Hyderabad, India
8d
Plan and execute full chip timing activities and signoff for advanced chiplets in latest technologies.
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Physical Design Engineer II
Microsoft
India, Karnataka, Bangalore
8d
Responsible for physical design implementation and integration at block, subsystem, sub-chip, and full-chip levels to develop cutting-edge semiconductor products.
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ASIC Design Engineer, High Speed IO
NVIDIA
India, Bengaluru
9d
Design and implement High Speed IO IP (USB, UFS, Ethernet, PCIe) for next-generation automotive chips.
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ASIC Physical Design Engineer
Broadcom
Singapore-Yishun
9d
Design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm/2nm process technologies using commercial and in-house EDA tools.
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IC Design Engineer (DFT)
Broadcom
China-Shanghai-Zhangjiang Hi Tech
9d
Define chip-level DFT architecture and implement test schemes (scan, BIST, MBIST) for 5nm/3nm ASIC designs.
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ASIC Engineer || Physical Design, CAD Methodology || STA Setup, Convergence Methodology || Exp 4+ years
Cisco
Bangalore, India
9d
Physical Design Engineer responsible for backend implementation of complex networking chips from RTL to GDS, focusing on timing closure, power integrity, and performance optimization.
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Silicon Physical Design Engineer V
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Fresh Consulting
Remote
9d
ASIC power analysis and optimization engineer managing power flows, signoff, and PPA optimization for digital designs.
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ASIC Physical Design Engineer - New College Graduate
NVIDIA
Taiwan, Hsinchu
9d
Responsible for the stage from RTL frozen to tape out, including synthesis, formal verification, constraints definition, and timing closure/sign-off for digital chips.
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Physical Design Engineer
NVIDIA
Israel, Tel Aviv
9d
Design high-speed communication chips (Networking Silicon) focusing on power, area, and performance optimization.
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Senior STA Engineer
NVIDIA
Israel, Tel Aviv
9d
Drive static timing analysis, timing closure, and signoff quality for complex ASIC and SoC designs at advanced process nodes.
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Senior ASIC Timing Engineer, DFT
NVIDIA
US, CA, Santa Clara
$136k
9d
Drive timing analysis and closure for DFT logic on all Nvidia chips (GPUs/CPUs/DPUs/LPUs/SoCs) at all hierarchical levels.
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Sr. Tech Lead SRAM ROM Expert
Nxp
Bangalore, IN
9d
Define and drive next-generation SRAM and ROM architectures for embedded and standalone memory products, including In-Memory Computing (IMC) solutions for AI/ML acceleration.
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Graduate Talent (CPU-SoC Silicon Design)
Intel
Malaysia, Penang
9d
Design and development of next generation SOC/CPU for Intel products, including RTL validation, structural physical design, and analog IP development.
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IC Design Engineer
Broadcom
Singapore-Yishun
9d
Leading team in physical design implementation of large System-On-Chip ASICs (500-800M gates) for computing and networking products.
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Lead Design Engineer
Nxp
Noida, IN
9d
Lead RTL Design Engineer contributing to semiconductor technology development, focusing on circuit design, layout, simulation, and validation.
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IC Design Engineer
Broadcom
Singapore-Yishun
9d
Design and implementation of 400–800 million gate integrated circuits using commercial and in-house EDA tools across 7nm/5nm/3nm/2nm process technologies.
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FPGA Engineer (Mid/Intermediate Level)
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Technica Electronics
Sant Cugat del Vallès, Catalonia, Spain
9d
Design, develop, simulate, and test FPGA modules for automotive connectivity and computing applications, implementing firmware for in-house hardware platforms.
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Master Thesis: Configurable Access Policies for Hardware Priority Queue Schedulers
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Ericsson
Stockholm, Stockholm County, Sweden
9d
Investigate the design space of configurable access policies for hardware priority queue schedulers in heterogeneous computing platforms.
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ASIC Design Engineer, High Speed IO
NVIDIA
India, Bengaluru
9d
Design and verify High Speed IO IP blocks (UFS, Ethernet, PCIe, USB) for next-generation automotive chips.
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Leader, Hardware Engineering
Cisco
San Jose, California, US
$195k
9d
Lead hardware engineering for next-generation Hyperscaler Switches, defining system specifications, board design, and bringing up complex hardware platforms for Cisco's core Switching, Routing, and Wireless products.
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Senior Principal Digital Design Engineer
Nxp
Noida, IN
9d
Senior RTL Design Engineer developing semiconductor technology and SoC integration.
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SoC Power Analysis and Optimization Engineer
Apple
Austin, United States of America
9d
Drive automation for System-on-Chip (SoC) power analysis, optimization, and modeling to improve power efficiency across IPs.
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Sr. Principal VLSI/ ASIC Design Engineer
Hpe
Sunnyvale, California, United States of America
9d
Lead early-stage ASIC architecture, RTL design, and implementation for complex networking, compute, and SoC applications.
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PCIe Design Engineer
Broadcom
IND-Bangalore Electronic City - S1, IN
9d
Designing PCIe subsystems and SoCs for Broadcom ASIC products, focusing on high-speed interface protocols and silicon bring-up.
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Principal/Senior Engineer, IP Engineering
GlobalFoundries
TWN - T'ai-wan - Hsinchu, TW
9d
Develop high-performance compute processor IP products through planning, execution, and delivery of technical engagements and product developments.
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Senior Product Engineer - STA
Siemens-Eda
Noida, IND, India
9d
Senior Product Engineer specializing in Static Timing Analysis (STA) and physical design flows for 7nm and 5nm semiconductor chip designs.
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Product Engineer - STA
Siemens-Eda
Noida, IND, India
9d
Develop and optimize placement, CTS, and routing flows for 7nm and 5nm semiconductor designs using Aprisa tools while providing expert technical support and training to customers.
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Principal Physical Design CAD Engineer
Asteralabs
Haifa
9d
Develop, maintain, and improve CAD flows and methodologies for physical design teams, supporting advanced implementation stages from synthesis through place and route, timing closure, power optimization, and signoff readiness.
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