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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,420 open positions
Physical Design Engineer/STA
Altera
Regus, Madhapur
19d
Performs physical design implementation of custom IP and SoC designs from RTL to GDS, conducting verification and signoff to create manufacturing-ready design databases.
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Design Engineer
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Arm
KA, IN
19d
Develop transistor-level physical layouts for Arm custom standard cells in sub-3nm process nodes to deliver high-performance, area-optimized logic libraries for next-generation SoCs and custom digital IPs.
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Digital Design Engineer - MCU
Nxp
Catania
$38k–$38k
19d
Develop digital sub-circuits for complex System-on-Chip (SoC) designs, focusing on RTL coding, synthesis, verification, and power analysis for high-performance microcontrollers.
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Principal Physical Design Engineer - MCU
Nxp
Catania
$61k–$61k
19d
Lead physical design and implementation of complex, high-performance semiconductor integrated circuits for micro-controllers (MCUs) and edge processing solutions.
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Staff Silicon Physical Design Engineer - Bengaluru
Graphcore
Bengaluru
21d
Designing high-performance, power-efficient AI superchips at leading-edge process nodes using state-of-the-art EDA tools and in-house flows.
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FPGA Design Engineer - 964
Quantinuum
US Broomfield, CO
21d
Lead FPGA design for the digital control system of quantum computers, coordinating electronics and processing signals.
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FPGA Designer
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Lumentum Operations
Ottawa, ON, CA
$93k–$93k
21d
Design control and datapath logic for next-generation optical cloud and networking technology using FPGAs.
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FPGA Design Engineer
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Aten Canada Technologies Inc.
Richmond, BC, CA
$60k–$60k
21d
Develop and verify high-speed FPGA systems and implement data/signal processing algorithms for world-leading KVM switches.
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SoC-FPGA Entwickler (m/w/d)
Backnang, BADEN_WUERTTEMBERG
21d
Design, verification, and deployment of complex FPGA/SoC solutions for high-tech industrial manufacturing systems.
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Principal Design Engineer
Microsoft
United States, California, Mountain View
21d
Leading high-performance, high-bandwidth digital design for IP microarchitecture, RTL, synthesis, and SoC integration.
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Principal Subsystem Design Engineer
Microsoft
United States, North Carolina, Raleigh
22d
Lead the design, integration, and verification of high-performance, complex SoC memory subsystems, driving solutions from architecture through silicon bring-up.
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Principal Electrical Design Engineer
Asteralabs
San Jose
22d
Define and drive architecture, design, and technical strategy for advanced board-level hardware across next-generation networking and high-performance connectivity platforms.
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SRAM Physical Design Engineer
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AMD
Boxborough, MA, US
22d
Design and optimize high-performance SRAM and memory structures for next-generation CPU cores.
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Physical Design Engineer
Marvell
Cordoba, Argentina
22d
Physical design and methodology for next-generation high-performance processor chips in leading-edge CMOS process technology.
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Senior ASIC Engineer, Switch SoC
NVIDIA
India, Bengaluru
22d
Design and integrate next-generation Switch Silicon chips, defining system-level methodologies and driving cross-functional teams to deliver high-throughput, low-latency communication devices.
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Sr HW Design Engineer
Ffive
Spokane Valley, US
$161k–$161k
22d
Lead system-level hardware design for high-performance electronic systems, driving development from concept through production release.
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Physical Design Engineer
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Marvell Technology
Córdoba, X, AR
22d
Physical design and methodology for next-generation high-performance processor chips in leading-edge CMOS process technology.
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FPGA Designer
Lumentum
Canada - Ottawa (Bill Leathem)
$93k–$93k
22d
Design control and datapath logic for advanced photonic modules powering AI, cloud computing, and telecom networks.
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Researchers (Secure FPGA Design and Verification)
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Tum Create Limited
Clementi, S00, SG
22d
Developing an open and verifiable Quantum safe RISC-V processor platform for post-quantum security research.
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Physical Design Engineer Intern, MS - Summer 2027
Marvell
Santa Clara, CA, US
$71k–$141k
22d
Intern role focused on physical design of ASIC and processor designs, performing synthesis, floor planning, place and route, and timing closure for next-gen data center chips.
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Senior Principal Engineer - IP Design
Nxp
Noida
22d
Architecting and developing complex Vision IP solutions for Automotive Self Driving Vehicles (ADAS), including Vision, Radar, In-Vehicle networks, and Gateway Systems.
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Semiconductor Design Engineer
Micron
San Jose, CA
$174k–$174k
22d
Design and validate on-chip controllers and mixed-signal circuitry for NAND Flash chips, including architecture development, system integration, and full-chip validation.
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Senior Chip Design Engineer
NVIDIA
Israel, Tel Aviv
22d
Design performance and power management related IPs for Networking silicon, collaborating with Architecture and Verification teams.
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Senior Softwareingenieur FPGA / VHDL (m/w/d)
Ulm, Donau, BADEN_WUERTTEMBERG
22d
Develop and implement FPGA and VHDL-based solutions and FPGA firmware for embedded systems.
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Digital Design Engineer
Silabs
Oslo
$479k–$479k
22d
Develop digital architectures, IP, processors, compute engines, and peripherals for Silicon Labs IoT mixed-signal SoCs.
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Sr. Director, SoC Architecture
Ambiqmicroinc
Austin HQ
23d
Define system architecture for next-generation ultra-low-power AI SoCs powering wearables, IoT, and battery-constrained edge devices.
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Principal Hardware Architect
Microsoft
United States, Oregon, Hillsboro
23d
Architecting and developing memory controllers for SoC/platforms, evaluating emerging memory technologies, and optimizing full-stack memory hierarchy performance.
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Senior Chip Lead Engineer-SoC/ASIC
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AMD
San Jose, CA, US
23d
Lead full-chip programs from architecture through production, serving as a technical partner to chip leads across cross-functional teams.
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Senior Engineer, Physical Design - Interconnects
Sifive
Bengaluru, Karnataka, India
23d
Senior Physical Design Engineer responsible for RTL-to-GDSII implementation of high-speed System IP components including Network-on-Chips (NoC), coherent CPU clusters, and Uncore subsystems.
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Neuromorphic Front-End Silicon Lead
Intel
US, Oregon, Hillsboro
$221k–$312k
23d
Lead design and verification of neuromorphic chiplets and IP for physical AI systems, translating hardware innovations into manufacturable silicon.
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Digital Hardware Engineer
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Qualcomm
San Diego, CA, US
$90k–$90k
23d
Develop and verify complex wireless systems, specifically a Test Base Station (TBS) for 6G physical layer functionality.
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Senior Principal Engineer, Physical Design Methodology & RTL-to-GDS Architecture
Sifive
Bengaluru, Karnataka, India
23d
Chief visionary and architect of the physical implementation backbone for next-generation, high-frequency CPU cores, pioneering AI-native automated methodologies for sub-3nm nodes.
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Engineer II, Physical Design - Cores
Sifive
Bengaluru, Karnataka, India
23d
Entry-level Physical Design Engineer building high-performance RISC-V CPUs from RTL to GDSII, bridging computer architecture with physical implementation to optimize Power, Performance, and Area (PPA).
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Digital Design Engineer Lead - Custom Silicon Management
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Apple
Austin, TX, US
$176k–$176k
23d
Lead technical engagements between Apple and silicon suppliers to define, develop, and productize custom silicon for mobile products including iPhone, iPad, and AppleTV.
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Chassis IP Senior Design Engineer
Intel
India, Bangalore
23d
Design and develop logic for component and foundation IPs used to build System-on-Chip (SoC) chassis, including high-performance routers, switches, and protocol bridges.
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Power Engineering Architect
Cerebras
Sunnyvale, CA
$230k–$230k
23d
Lead power delivery architecture and strategy for high-performance compute, AI/ML accelerators, and advanced ASIC platforms.
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Senior Physical Design Engineer - P&R
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Bta Design Services
Remote
23d
Senior Physical Design Engineer owning backend implementation from netlist to GDSII for advanced silicon platforms targeting next-gen AI infrastructure.
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CAD Engineer
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Apple
Austin, TX, US
$129k–$129k
23d
Developing flows, tools, and methodologies for next-generation, high-performance, power-efficient SoCs (CPU, GPU, Analog/Mixed Signal) to enable Apple products.
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FPGA und Embedded Software Ingenieur (m/w/d)
Remote
23d
Design and verification of FPGA modules for Xilinx SoCs, development of C++ drivers, and embedded signal processing software in C++ (RTOS).
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Circuit Design Engineer
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Apple
Santa Clara, CA, US
$145k–$145k
23d
Design advanced custom digital megacells (SRAM, on-chip sensors, ML accelerators) for high-performance, low-power System-on-Chip (SOC) architectures.
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ASIC Development Engineer
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Microchip Technology
Burnaby, BC, CA
$76k–$76k
23d
Design, verification, emulation, and validation of digital integrated circuits (SoCs) for storage and memory controllers.
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CPU Physical Design Timing Engineer
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Qualcomm
Santa Clara, CA, US
$199k–$199k
23d
Define, develop, and drive CPU timing closure for Oryon CPU cores, working with microarchitecture and RTL design teams to meet aggressive power, area, and performance goals.
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Custom HBM Architecture and Design Engineer
Micron
Richardson, TX, US
$165k–$165k
23d
Architect, design, and implement RTL for next-generation HBM SoC logic die, focusing on memory sub-systems, IP integration, and system-level optimization for AI/ML workloads.
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PCB Layout Engineering Lead
Cerebras
Remote
$210k–$210k
23d
Lead the physical implementation of complex, high-performance printed circuit boards for AI systems, optimizing signal integrity, power integrity, thermal performance, and manufactability.
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Leader, Hardware Engineering - 10+ years of proven experience as Product/Design Engineer with expertise in electronic product design and architecture.
Cisco
Bangalore, India
23d
Lead a product engineering team delivering high-performance routers and switches (Cisco 8000 series) using Silicon One ASIC architecture for AI and 5G networks.
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Radiation Effects & RAS Silicon Architect
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AMD
San Jose, CA, US
23d
Define and develop architecture for radiation-tolerant FPGA and SoC products, focusing on Single Event Effects (SEE) mitigation and RAS solutions for terrestrial and space markets.
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System IP RTL Design Lead
Tenstorrent
Bengaluru
23d
Lead the definition, selection, and integration of complex datacenter-class System IP and SoC architectures for next-generation semiconductor products.
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Principal Silicon Architect
Microsoft
United States, California, Mountain View
$143k–$143k
24d
Provide technical leadership for early architecture definition and specification of Network-on-Chip (NoC), memory/interconnect subsystems for high-performance AI and compute SoCs.
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ASIC Engineering Director
Blueorigin
Kraków, Poland
24d
Establish and lead the ASIC engineering organization in Krakow, Poland, focusing on design verification, front-end design, digital architecture, and embedded hardware integration for high-performance communication SoCs.
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Director, ASIC Software Engineering
Blueorigin
Kraków, Poland
24d
Lead a multidisciplinary software organization to develop the full software ecosystem for custom ASICs and SoCs, enabling next-generation space-based communications for Terawave systems.
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