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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
2,687 open positions
Solutions Architect-FPGA
Advanced Micro Devices, Inc
San Jose, California
12d
Architect and develop hardware/software co-design solutions for FPGA-based acceleration in networking, storage, automotive, aerospace, and AI/ML workloads.
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Director High Speed IO Architecture & Design
Advanced Micro Devices, Inc
Santa Clara, California
12d
Lead a Hardware/Digital IP Design Engineering team to develop next-generation high-speed I/O technologies and reusable IP for multi-product roadmaps.
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Director, CPU Silicon Engineering
Advanced Micro Devices, Inc
Fort Collins, Colorado
12d
Provide technical and organizational leadership for advanced CPU/core silicon engineering, spanning silicon development, validation, post-silicon execution, debug, and cross-functional coordination.
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Principal FPGA Emulation Engineer
Renesas-Electronics
Austin, TX, us
12d
Build and own FPGA-based platforms to emulate mixed-signal power ASICs before silicon, validating real-time digital, mixed-signal, and power-control architectures.
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SiP System and Design Architect (m/f/d)
Aumovio
Regensburg, BY, de
12d
Translating product requirements into executable SiP functional architectures, chip/chiplet partitions, and package-level design concepts for automotive electronics.
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Staff Silicon Design Engineer
Advanced Micro Devices, Inc
Dublin, Ireland
12d
Design front-end digital architecture and RTL for RF data converter sub-systems and mixed-signal ICs using advanced CMOS processes.
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Staff Engineer, Digital Design Engineering
Analog Devices
España
12d
Design complex mixed-signal integrated circuits for automotive high-speed serial data communications (GMSL SerDes) for safety and infotainment systems.
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PCB and Package Design Engineer for SoC Products
Renesas-Electronics
Kodaira, jp
12d
Lead PCB and Package design for System-on-Chip (SoC) products targeting industrial equipment and physical AI applications, ensuring system-level feasibility and optimization.
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Physical Design Engineer
Qualcomm
Santa Clara, California, United States of America
13d
Execute and drive all stages of the physical design flow from synthesized netlist to tape-out for complex, high-speed, and low-power ASICs and SoCs.
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Staff Hardware Engineer
Arm
Cambridge, United Kingdom
13d
Design, develop, and verify synthesizable RTL for innovative hardware platforms and subsystems, balancing performance, power, and area.
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Lead Product Engineer - Synthesis
Siemens-Eda
Bangalore, IND, India
13d
Lead a team of engineers to solve critical logic synthesis challenges and drive the roadmap for next-generation RTL2GDSII solutions for complex digital IC designs.
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Graphics (GPU) RTL Design Engineer
Apple
Austin, United States of America
13d
Design and manufacture high-performance, power-efficient GPU microarchitectures for mobile and PC devices.
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Post Silicon Performance Architect
Apple
Haifa, Israel
13d
Analyze and tune performance and power of Apple Silicon for Mac, driving SoC architecture changes for future chips.
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Principal Modem SOC Design Engineer - Terawave
Blueorigin
Central Texas, US
$269k–$377k
13d
Technical design leader for the TeraWave satellite communication System on Chip (SOC), leading RTL design and microarchitecture definition for modem subsystems.
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Staff Digital Design Engineer
Infineon
San Jose, CA
13d
Execute hands-on digital IP and SoC design, including micro-architecture refinement, RTL implementation, and integration support for automotive networking chips.
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ASIC Engineer
Cisco
Bangalore, India
13d
Define, design, and verify high-performance ASIC and ASIC subsystems for deployment in Cisco networking platforms.
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System Architect Senior Staff Engineer
Qualcomm
Shanghai, China
13d
Design and advance Packet Processing Engine (PPE) architectures for automotive and TSN use cases, balancing performance, power, and cost.
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Principal ASIC Engineering Program Manager
Hpe
Ft. Collins, Colorado, United States of America
$140k–$321k
13d
Provide strategic technical coordination and program leadership for complex ASIC development across architecture, design, verification, physical implementation, validation, and manufacturing readiness.
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SiP System and Design Architect (m/f/d)
AUMOVIO SE Haupverwaltung
Deutschland
13d
Translating product requirements into executable SiP functional architectures, chip/chiplet partitions, and package-level design concepts for automotive electronics.
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Senior Principal Engineer, Physical Designer
Marvell
Santa Clara, CA, US
$178k–$266k
13d
Senior leader shaping long-term vision and leading RTL-to-GDSII implementation for next-generation high-performance processor chips in leading-edge CMOS processes for server and networking applications.
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CPU Physical Design Engineer
Intel
US, Texas, Austin
$106k–$200k
13d
Physical design and verification of high-performance, power-efficient CPUs from RTL to GDSII.
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Junior ASIC Backend Engineer
Axis
Sweden - Lund
13d
Implementing the physical design phase of ARTPEC SoC chips, including floor-planning, synthesis, timing closure, and power integrity analysis.
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Digital Design Manager
GlobalFoundries
ITA - Lombardy - Pavia, IT
13d
Lead the development of digital architecture and implementation for next-generation power management ASICs, specifically high-performance DC-DC converter solutions for AI and data center applications.
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Staff Engineer, ASIC Digital Design
Micron
Minneapolis, Minnesota, United States of America
$150k–$256k
13d
Design next-generation DRAM/NAND/SSD controllers and systems, translating architectural requirements into detailed microarchitecture specifications and robust hardware implementations.
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Senior Hardware Engineer - SoC Architecture & Design - Qualcomm - Grenoble, France
Qualcomm
Grenoble, France
13d
Define SoC and subsystem architectures and micro-architectures, develop and integrate CPUs, accelerators, memory, and interconnect solutions, and write high-quality RTL for next-generation SoCs and compute platforms.
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GPU Logic Design Engineer
Intel
US, California, Folsom
$142k–$200k
13d
Design GPU logic blocks and microarchitecture features, optimizing for power, performance, area, and timing while ensuring integration into full chip designs.
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Senior FPGA Research Engineer
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Barco
Vancouver, BC, CA
13d
Lead FPGA architecture for sensor acquisition, synchronization, aggregation, and delivery to edge AI compute modules in industrial imaging systems.
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FY27 Intern - Camera Design Engineering Internship - Canada (12 or 16 months)
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Qualcomm
Vancouver, British Columbia, Canada
$55k–$103k
13d
RTL design and development for camera hardware, focusing on power, area, and performance optimization.
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Senior FPGA Engineer (Hybrid)
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Kardium Inc.
Burnaby, BC, CA
CA$100k–CA$150k
13d
Develop and verify FPGA-based systems for a medical device treating atrial fibrillation.
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FPGA Team Lead (Hybrid)
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Kardium Inc.
Burnaby, BC, CA
CA$119k–CA$170k
13d
Lead the development, testing, and maintenance of FPGA designs for The Globe® Pulsed Field System, a medical device for diagnosing and treating atrial fibrillation.
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Power Methodology and Analysis Engineer
NVIDIA
China, Shanghai
13d
Researching, developing, and deploying methodologies to analyze and reduce power consumption of NVIDIA chips, specifically GPUs and Tegra SOCs.
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Senior Modem SOC Design Engineer - TeraWave
Blueorigin
Central Texas, US
$230k–$323k
13d
Design digital hardware for the TeraWave satellite communication System on Chip (SOC), focusing on modem datapath, PHY blocks, and Arm compute subsystems.
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Custom SOC ASIC Engineer - New College Grad 2027
NVIDIA
China, Shanghai
13d
Design, analyze, and evolve next-generation NVLink Fusion SoC systems and sub-systems.
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HW IP designer - Qualcomm - Guyancourt or Sophia, France
Qualcomm
Bainbridge, Alpes-de-Haute-Provence, France
13d
Design hardware IP units for SoC NoC, covering specification, microarchitecture, and RTL code.
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System Architect Principal Engineer
Qualcomm
Shanghai, China
13d
Define and advance Packet Processing Engine (PPE) architectures for automotive and TSN use cases, optimizing performance, power, and cost.
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Physical Design Engineer
Qualcomm
Austin, Texas, United States of America
13d
Execute and drive all stages of the physical design flow from synthesized netlist to tape-out for complex, high-speed, and low-power ASICs and SoCs.
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VLSI Physical Design Engineer
Hpe
Ft. Collins, Colorado, United States of America
$115k–$218k
13d
Design, analyze, develop, and evaluate VLSI components and hardware systems, including architecture, logic design, verification, and physical implementation of complex integrated circuits.
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VLSI Physical Design Lead Engineer
Hpe
Ft. Collins, Colorado, United States of America
$168k–$319k
13d
Lead the development of VLSI components and hardware systems, defining architectures and physical implementations for complex integrated circuits.
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Custom SOC ASIC Engineer - New College Grad 2027
NVIDIA
China, Shanghai
13d
Design, analyze, and evolve next-generation NVLink Fusion SoC systems and sub-systems.
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ASIC Logic Design Engineer for Wireless SoC Group
Apple
Israel, Israel
13d
Designing block and/or sub-system micro-architecture and implementation for next-generation, power-efficient system-on-chip (SoC) in wireless silicon.
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Senior Director, Central Engineering – SoC Design & Modeling Methodologies
Renesas-Electronics
San Jose, CALIFORNIA, us
13d
Lead workload and performance analysis, hardware/software (HW/SW) optimization and co-design (including AI workloads), and SoC architecture for semiconductor products.
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Senior Logic Design Engineer
Microsoft
United States, Oregon, Hillsboro
13d
Design and build PCIe subsystems and other IP blocks for System-on-Chip (SoC) implementations, ensuring they meet area, power, and performance requirements.
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SoC Clocking Specialist (Physical Design)
Enchargeai36
India
13d
Lead clock architecture and physical implementation for next-generation edge AI hardware SoCs.
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FPGA Design Engineer - 1091
Quantinuum
US Broomfield, CO
13d
Lead FPGA design for the digital control system of Apollo quantum computers, coordinating electronics and interfacing with DACs/ADCs, DDRx memory, and signal processing.
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Principal Engineer, SoC Architect
Renesas-Electronics
Bengaluru, KA, in
13d
Define end-to-end SoC solutions and product portfolio strategy for India's automotive, industrial, infrastructure, and IoT markets.
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RTL Design Engineer - PCIe
Advanced Micro Devices, Inc
Hyderabad, India
13d
Define and develop SoC and subsystem architecture, translating requirements into interfaces, data flows, and implementation specifications for next-generation complex SoCs.
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Physical ASIC Design Implementation Engineer
Engibex
Leuven
13d
Physical Implementation engineer for full backend (P&R) projects from netlist-in to GDSII-out flow, handling toplevel chips and blocklevel blocks.
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CPU Subsystem Development
Renesas-Electronics
Kodaira, Tokyo, jp
14d
Lead the development, architecture definition, specification, design, and verification of CPU subsystems (CPUSS) for next-generation microcontrollers, focusing on performance, power, and area optimization.
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CPUサブシステム開発
Renesas-Electronics
Kodaira, Tokyo, jp
14d
Lead the development of CPU subsystems (CPUSS) serving as the core function of microcontrollers, including architecture design, specification, development, and verification.
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FY27 Intern - Camera Design Engineering Internship - Canada (12 or 16 months)
Qualcomm
Vancouver, British Columbia, Canada
14d
RTL design and development for camera hardware, focusing on power, area, and performance optimization.
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