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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
2,687 open positions
Staff/Senior Staff Physical Design Floorplan & PDN Lead
Enchargeai36
India
8mo
Architecting chip-level floorplans and Power Delivery Networks (PDN) for complex, large-scale SoCs to balance performance, power, and area.
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Sr Engineer, Design Enablement
Renesas-Electronics
Hyderabad, in
8mo
Develop and define Synthesis & Static Timing Analysis (STA) flows and methodologies for Advanced SoCs and MCUs on low geometry nodes (3/5/16/22nm).
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<Data Center>High-Speed Digital IC Design & Integration Engineer
MediaTek
HsinChu
8mo
High-speed digital IC design implementation and integration from RTL to gate level.
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Principal Engineer, Architecture/Chip Leader
Renesas-Electronics
Kodaira, jp
8mo
Lead the SoC/MCU architecture team to define system architecture and technical specifications for high-performance System-on-Chip and Microcontroller Unit products.
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Principal Engineer of SoC/MCU Architecture
Renesas-Electronics
Kodaira, jp
8mo
Define SoC/MCU architectures and detailed technical specifications for high-performance chips used in autonomous driving systems, serving business, product marketing, and system architects.
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Senior FPGA Engineer (w/m/d)
Trumpf
Remote
8mo
Designing digital hardware solutions and FPGA architectures for device platforms, from concept to implementation, ensuring optimal integration with RF and power electronics.
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Staff/ Sr Staff Engineer, Physical Design
Renesas-Electronics
Noida, in
8mo
Own RTL synthesis from elaboration to final sign-off, perform logic equivalence checks (LEC), develop and debug UPF, and manage power domains for complex SoC designs.
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Static Timing Analysis Engineer
Accenture
Bengaluru
8mo
Analyze and verify the timing of digital circuits to ensure they meet performance requirements under various operating conditions.
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IP RTL Design Engineer
Samsung Electronics
SSIR, Goldstone, Bangalore, India
8mo
Senior IP Design Engineer developing RTL, synthesis, and verification for complex Image Sensor IP modules.
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2026 Intern-Physical Design Engineer
Qualcomm
Shanghai, China
8mo
Handle physical design tasks from Verilog netlist to GDS, including floorplanning, placement, CTS, routing, timing analysis, and signoff.
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SOC RTL Design Engineer
Samsung Electronics
SSIR, Goldstone, Bangalore, India
8mo
IP/BLK level RTL integration and design of IP/glues/wrappers involving complex high-speed protocol integration.
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2026 Intern-Digital Design/Verification Engineer
Qualcomm
Shanghai, China
8mo
ASIC IP/SoC design and verification, participating in the whole ASIC flow including micro architecture specification, RTL implementation, design verification, synthesis, timing closure, power estimation, DFT, validation, software support, and post-silicon…
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CPU STA - Sr/Lead/Staff/Sr Staff Engineer
Qualcomm
Hyderabad, Telangāna, India
8mo
Senior CPU Static Timing Analysis (STA) engineer responsible for timing closure, constraint management, and verification in high-speed ASIC designs.
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DSP Firmware Engineer
Marvell
Cordoba, Argentina
8mo
Design, simulate, implement, and validate DSP ASICs for coherent optical transmission in fiber networks.
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Physical Design Engineer
MediaTek
Bangalore
8mo
Own planning, execution, and closure of complex digital blocks, managing floorplanning, placement, CTS, routing, and timing closure to ensure signoff readiness.
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Digital Design Manager
Texas Instruments
Bengaluru, Karnataka, India
8mo
End-to-end delivery of the first T28 industrial ASIC, combining full chip ownership with RTL team leadership to ensure first-time-right silicon and scalable architecture.
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Front-End CAD Methodology Engineer – Design/DV Interface
Apple
San Francisco Bay Area, United States of America
8mo
Design and manufacture next-generation, high-performance, power-efficient processor and system-on-chip (SoC) by creating robust, scalable methodology solutions for RTL Design and DV teams.
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Principal GPU Memory Architect
NVIDIA
US, CA, Santa Clara
$272k
8mo
Designing high-performance GPU memory systems and processor architectures to maximize power-constrained performance (perf/W, perf/mm, perf/$) and energy efficiency.
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Engineer/Staff Engineer – Chip Physical Verification Engineer
MediaTek
Singapore
8mo
Define and enable physical sign-off flow and solutions for System-on-Chip (SOC) design in advanced technology nodes.
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FPGA Design Engineer
Thermoteknix
Cambridge (UK) / Remote
8mo
Design and contribute FPGA modules to a reusable library for thermal imaging, night vision, and augmented reality systems.
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Design Engineer
Broadcom
USA-Colorado-Fort Collins-4380 Ziegler Road
$60k
8mo
Physical implementation of high-performance custom CMOS ASICs for AI, Cellular, Networking, Computing, and Storage products.
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Senior Physical Design Backend Engineer
NVIDIA
Israel, Tel Aviv
8mo
Design high-speed communication chips by performing physical design of blocks, resolving timing and congestion, and managing RTL-to-GDS flows to optimize power, area, and performance.
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Firmware Development Engineer
Altera
Jerusalem, Israel
8mo
Develop firmware for multi-protocol high-speed SERDES (up to 256Gbps) governing DSP and analog blocks, ensuring seamless interface management with higher-level system layers.
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Senior GPU Memory Subsystem Architect
NVIDIA
India, Bengaluru
8mo
Architect and optimize GPU memory subsystems, including performance modeling, simulation, and debugging to improve efficiency and resolve bottlenecks.
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Senior Physical Design Engineer
Enchargeai36
India
8mo
Lead physical implementation of complex silicon blocks from synthesis to sign-off, optimizing Power, Performance, and Area (PPA) for edge-to-cloud AI hardware.
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Principal Physical Design Engineer (RTL-to-GDSII)
Enchargeai36
India
8mo
Lead full-flow physical design implementation for massive, high-speed blocks and SoCs, transforming RTL into GDSII while optimizing PPA and eliminating systemic bottlenecks.
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Sr Principal Design Engineer
Cadence
PUNE 04, IN
8mo
Owns full DFT lifecycle for high-speed, low-power chip designs, defining test architecture and implementing RTL changes to ensure testability and timing closure.
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Physical Design Backend Engineer
NVIDIA
Israel, Tel Aviv
8mo
Physical design of high-speed communication chips, optimizing power, area, and performance under challenging constraints.
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STA Synthesis Engineer
Samsung Electronics
SSIR, Goldstone, Bangalore, India
8mo
Own timing constraints and drive timing closure for image sensor full chip and sub-system levels, including pre/post-layout analysis and ECO generation.
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GPU Physical Design Clocking Engineer
Apple
Austin, United States of America
9mo
Design and manufacture high-performance, power-efficient processor and system-on-chip (SoC) for Apple products, focusing on clocking aspects and large chip integration.
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Digital Design Engineer
Texas Instruments
Bengaluru, Karnataka, India
9mo
Design and development of digital logic circuits, signal chains, clocking, and memory management for highly complex mixed-signal audio devices.
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Sr Principal Digital Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
9mo
Sr. Principal Digital Design Engineer developing Power Management ICs (LED drivers, SiC drivers, smart-Switches, efuses) for consumer, industrial, and automotive applications.
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Staff Digital Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
9mo
Lead digital design architecture, RTL, low power design, synthesis, and timing analysis for power management chips including DC-DC PMIC, multiphase controllers, and LED drivers.
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Principal Digital Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
9mo
Lead digital design architecture, RTL, low power design, synthesis, and timing analysis for power management chips serving consumer, industrial, and automotive applications.
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Computing System Architecture Engineer (Memory System Model and Optimization)
MediaTek
HsinChu
9mo
Designing memory subsystems and interconnects for smartphones, automotive, HPC, and data centers, with a focus on system-level SW/HW behavioral power/performance analysis and optimization.
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HSIO architect
MediaTek
HsinChu
9mo
Designing PC south bridge and USB host chipsets while ensuring compliance with HSIO specifications.
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NAND BM IP RTL Design Engineer
Samsung Electronics
9mo
Designing high-performance RTL for Samsung Memory products (Flash, DRAM) with a focus on concept study, specification, and micro-architecture.
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SENIOR ASIC Engineer
Micron
Hsinchu County, Hsinchu County, Taiwan
9mo
Lead top-level SoC integration, RTL design, and high-speed protocol implementation (PCIe, USB, SATA) for memory and storage solutions.
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Senior GPU Top Design Engineer
Apple
Cambridge, United Kingdom
9mo
Develops micro-architecture and RTL for critical top-level GPU infrastructure IP, including interconnects, control logic, and clocking/reset distribution, driving system-level optimizations.
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Physical Design Engineer - Foundry Team
Samsung Electronics
SSIR, Goldstone, Bangalore, India
9mo
Physical design and timing closure for complex System-on-Chip (SoC) top-level implementations in mobile application processors, modem sub-systems, and connectivity chips.
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Principal Design Engineer
Cadence
BANGALORE
9mo
Designing high-performance physical IP for industry-standard protocols, covering digital architecture, RTL, low-power design, and synthesis for SerDes portfolios.
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Emulation Hardware Project Manager
Siemens-Eda
Remote
$130k
9mo
Planning, coordinating, and delivering emulation hardware support projects across engineering, IT, facilities, and vendor teams to ensure emulation platforms are deployed, maintained, upgraded, and supported on schedule.
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SoC Physical Design Engineer, Top Level
Apple
San Jose, United States of America
9mo
Implement complete chip design from netlist to tapeout, driving physical aspects early in the design cycle and resolving design/flow issues.
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Principal Memory Design Engineer/Senior Technical Manager
MediaTek
San Jose, CA
9mo
Architecting and defining high-performance memory circuits for Data Center AI, Networking, and Edge AI ASIC solutions.
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SoC Power Spec Engineer
Apple
Beaverton, United States of America
9mo
Modeling power dissipation at the SOC level for Apple products, including AI/ML accelerators, CPUs, graphics, and media IPs.
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SoC Physical Design Engineer, Top Level
Apple
San Jose, United States of America
9mo
Implement complete chip design from netlist to tapeout, focusing on top-level physical design and flow optimization.
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STCO Methodology & Framework Technologist, up to Staff
Qualcomm
Hsinchu City, Taiwan
9mo
Develop system-level STCO methodologies and data-driven frameworks to enable early-stage architecture analysis, optimization, and trade-off evaluation for advanced SoCs and chiplet-based platforms.
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SoC Physical Design Engineer, Top Level
Apple
San Jose, United States of America
9mo
Implement complete chip design from netlist to tapeout, focusing on top-level physical design and flow optimization.
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DFT STA Lead
MediaTek
Bangalore
9mo
End-to-end DFT STA including SDC creation, sanity checks, CCD, CTS cleanup, and all-mode timing closure for top and block levels.
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Experienced GPU Electrical Analysis Engineer
Apple
Cambridge, United Kingdom
9mo
Design and manufacture next-generation, high-performance, power-efficient GPUs by ensuring electrical analysis closure from early design planning to tapeout.
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