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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
2,687 open positions
High-Speed I/F Subsystem Design Leader
Renesas-Electronics
Kodaira, jp
7mo
Define design direction and make technical decisions for the High-Speed I/F subsystem of automotive SoCs (R-Car series), focusing on PCIe, UCIe, USB, and UFS.
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ASIC Engineering Lead
Cisco
Armenia
7mo
Lead end-to-end physical implementation of high-complexity silicon blocks from RTL to tape-out, ensuring production-ready design delivery for innovative networking technology.
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Senior Director, SoC Power and Clocking Technology
Arm
Multiple locations
$383k
7mo
Lead a global team to architect and deliver verified designs for SoC power, clocking, reset, and thermal management solutions.
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Experienced SoC Design Engineer
Arm
Manchester, United Kingdom
7mo
Designing and integrating subsystems and logic for sophisticated processing systems optimized for performance and power across IoT, Automotive, and Infrastructure computing.
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Senior Logic Design Engineer, CPU Core
NVIDIA
Israel, Yokneam
7mo
Design and own units within a CPU core micro-architecture, writing RTL and collaborating with verification and implementation teams to meet timing, area, performance, and power goals.
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Neural Processing Unit Digital Designer
MediaTek
HsinChu
7mo
Designing, developing, and optimizing the architecture of neural processing units (NPUs) to meet performance, scalability, and efficiency requirements.
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Staff Digital Design Engineer
ON Semiconductor
Cork, Co. Cork, Ireland
7mo
Architecting and implementing digital FSM-based controllers and digital-on-top subsystems for mixed-signal and power management solutions.
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interconnect fabric design and system level cache IP engineer
MediaTek
HsinChu
7mo
Design interconnect, fabric, and system-level cache IP for products including smartphones and automotive.
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Lead STA Engineer
Texas Instruments
Bengaluru, Karnataka, India
7mo
Drive timing closure and synthesis optimization for advanced connectivity SoCs to ensure wireless solutions meet performance, power, and area requirements.
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Senior Principal System Performance Architect
Arm
Austin, Texas
$309k
7mo
Define SoC system and subsystem use-case performance and analysis requirements, driving analysis and testing from models to RTL to craft future compute infrastructure performance.
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<Data Center>Serdes Digital IC Design Engineer
MediaTek
HsinChu
7mo
Design and deliver ASIC Serdes PHY architecture for data center and AI products, focusing on low power, cost-effective, and high-speed performance.
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HSI Digital IC Design Engineer
MediaTek
HsinChu
7mo
Design and integrate high-speed interface subsystems (PCIe, USB, MIPI, HDMI, DisplayPort, CSI) and develop security and Functional Safety (FuSa) functions for digital circuits.
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Memory Controller Digital Engineer
MediaTek
HsinChu
7mo
Designing memory system architecture and developing DRAM controller IP for System on Chip (SoC) applications.
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SoC Integration IC Design Engineer
MediaTek
HsinChu
7mo
Integration of flagship smartphone and automotive System-on-Chip (SoC) designs, including floorplan and clock architecture.
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Senior/Expert Hardware Design Engineer - FPGA
Sopra-Steria
Montréal, QC, ca
7mo
Design, develop, and validate complex electronic modules (FPGA, CPLD, electronic boards, ASIC) for automotive and avionics applications, focusing on video processing and 4K resolution pipelines.
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Staff Digital IC Design Engineer
Renesas-Electronics
Lviv, ua
7mo
Design and integrate digital sub-blocks and chip-level implementations, performing verification, DFT strategy, and tape-out preparation for embedded semiconductor solutions.
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Power Optimization Engineer
Etchedai
Hardware Engineering
7mo
Develop chip power models, estimate power from microarchitecture, and devise power-saving techniques for AI ASICs.
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RTL Design Engineer
Etchedai
Hardware Engineering
7mo
Develop and implement design verification strategies for AI chips (ASICs) optimized for specific model architectures like transformers.
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Performance Modeling Engineer
Etchedai
Hardware Engineering
7mo
Develop and own SoC functional models for Etched's Sohu ASIC (transformer-optimized) from architecture to deployment, ensuring performance alignment with AI workloads.
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Reliability Engineer
Etchedai
Hardware Engineering
7mo
Ensuring components and systems meet rigorous reliability standards for datacenter applications and AI chips.
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Electrical Engineer, Hardware Systems
Etchedai
Hardware Engineering
7mo
Designing schematic layouts for AI accelerator mezzanine cards and base boards to enable high-throughput, low-latency inference for transformer-based models.
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Physical Design Engineer
Etchedai
Hardware Engineering
7mo
Implement and verify physical designs for AI chips (ASICs) optimized for specific model architectures like transformers.
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ASIC Timing Engineer
Etchedai
Hardware Engineering
7mo
Driving timing analysis and closure for next-generation AI chips designed for specific model architectures.
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STA Engineer (M, F, D)
Apple
Munich, Germany
7mo
Developing automated block and full chip level signoff flows, ensuring full chip timing/noise convergence and high-quality timing signoff.
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CPU Physical Design Engineer
MediaTek
Singapore
7mo
Physical design and development of MediaTek's GHz ARM-based microprocessors, focusing on timing-critical partition blocks.
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Principal SoC RTL Engineer
Ambiqmicroinc
Austin HQ
7mo
Own pre-tapeout quality for digital SoC modules on MCU platforms and drive architecture, microarchitecture, and RTL development for next-generation silicon.
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Power Analysis and Optimization Engineer
NVIDIA
China, Shanghai
7mo
Define power targets, find power saving opportunities, and solve power issues throughout the ASIC design process from architecture to P&R to ensure high Perf-per-Watt for NVIDIA GPUs and SOCs.
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Computing System Architecture Engineer (System Analysis and Model)
MediaTek
HsinChu
7mo
Conducting R&D on computing system architecture and performing system-level software/hardware behavior performance and power modeling for SoC optimization.
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Neural Processing Unit Design Engineer
MediaTek
HsinChu
7mo
Designing the architecture and RTL for AI processor subsystems, focusing on performance, power, bandwidth, and area optimization.
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Architect MTS
ON Semiconductor
Bangalore, Karnataka, India
7mo
Define the design architecture and methodologies for a new platform of digital compute and analog/mixed-signal products, targeting a large variety of different products.
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FPGA / Embedded Design Entwickler/In
Trenz Electronic GmbH
Hüllhorst, NORDRHEIN_WESTFALEN
7mo
Development of customer-specific FPGA/SoC designs and system architecture for complex industrial applications.
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High‑Speed IP Integration Engineer, Up to Snr Staff (USB/PCIe/UHS) (Hsinchu, Taipei)
Qualcomm
Hsinchu City, Taiwan
7mo
Architecting and implementing RTL designs for complex SoC platforms, focusing on the integration and performance evaluation of 3rd party IPs like USB, PCIe, and UHS.
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Staff RTL Design Engineer
Arm
Austin, Texas
$198k
7mo
Designing high-performance, energy-efficient interconnects for mobile, automotive, networking, and enterprise markets.
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Sr. Lead ASIC design Engineer - Digital Design
Nxp
Hyderabad
7mo
Define and implement hardware architectures optimized for AI inference SoCs, including custom-ISA processors and high-speed interconnects.
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Senior Out-of-Order CPU Architect
Intel
US, Texas, Austin
$191k
7mo
Define end-to-end CPU architecture specifications and microarchitectures for high-performance and low-power computing products.
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Senior ASIC Design Engineer
NVIDIA
US, CA, Santa Clara
$136k
7mo
Design and implement high-performance, area, and power-efficient RTL for world-leading SoCs and GPUs, including architecture and micro-architecture design.
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Senior Logic Design Engineer, Cache Coherent Interconnects
NVIDIA
US, CA, Santa Clara
$136k
7mo
Design CPU on-chip and off-chip interconnect networks, MP coherency, and last-level/system caches, including micro-architectural definition, RTL coding, logic debug, synthesis, and timing closure.
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Automotive Senior Hardware Engineer / Specialist / Architect
Bosch-Group
coimbatore, in
7mo
Lead hardware design and development for vehicle computers, communication gateways, zone ECUs, and power distribution ECUs from concept to production.
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CPU RTL Design Engineer
Qualcomm
Hsinchu City, Taiwan
7mo
Development of ARM/RISC-V architecture based complex CPU subsystems, including feature enhancement, micro-architecture, and RTL development.
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Lead Design Engineer
Cadence
BANGALORE
7mo
Lead Design Engineer responsible for RTL coding, datapath designs, complex FIFO design, and high-speed SerDes IP development.
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GPU Top RTL Designer
Apple
Austin, United States of America
8mo
Design and manufacture high-performance, power-efficient processor and system-on-chip (SoC) GPU logic for Apple devices.
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Senior CPU Design Engineer
NVIDIA
US, OR, Hillsboro
$168k
8mo
Designing high-performance, low-power CPUs for product lines including consumer graphics, self-driving cars, and AI.
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Senior CPU Design Engineer
NVIDIA
US, OR, Hillsboro
$168k–$265k
8mo
Design high-performance, low-power CPUs for product lines including consumer graphics, self-driving cars, and AI.
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Senior FPGA Design Engineer (f/m/div)
Infineon
Lviv (Ukraine)
8mo
Convert full-chip microcontroller ASIC to FPGA, define design constraints, and debug RTL integration.
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CPU MicroArchitect / RTL Engineer - Site Lead
Apple
Beaverton, United States of America
8mo
Design high-performance, low-power microprocessors for Apple products including iPhone, iPad, Watch, Vision Pro, and Mac.
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Senior Digital/AMS Validation and Integration Engineer
Nxp
San Jose (Holger Way)
$166k
8mo
Design and integrate RTL for control loops, calibration engines, and high-speed data paths in 10G+ Automotive SerDes transceivers, bridging digital logic with analog front-ends.
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System Design Engineer
NVIDIA
Taiwan, Taipei
8mo
Design and execution of next-generation NVIDIA products including GeForce, Virtualization, Datacenter, and Automotive platforms centered on GPUs, DPUs, CPUs, and LPUs.
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Design Manager
ON Semiconductor
Bangalore, Karnataka, India
8mo
Lead and manage a new product design team to develop digital compute products, including MCUs, DSPs, and hardware accelerators, while benchmarking systems for various applications.
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Sr. Staff Memory Design Engineer
MediaTek
San Jose, CA
8mo
Designing custom high-performance memory circuits (TCAM, SRAM, CPU caches) and advancing DTCO optimization techniques for next-generation ASICs targeting Cloud AI and Data Center applications.
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NPU/AI Processor Architecture (RTL) design- Staff/Sr Staff
Qualcomm
Bangalore, India
8mo
Designing high-performance, energy-efficient CPU and AI processors (Hexagon NPU) for Snapdragon chips and AI inference engines.
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