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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
2,686 open positions
Non-Volatile Memory (NVM) Architect
ON Semiconductor
Brno, South Moravia, Czech Republic
3mo
Lead the definition, architecture, and development of next-generation embedded memory IP solutions for automotive, industrial, AI, and mixed-signal SoCs.
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Senior Physical Design Engineer
MediaTek
Austin, TX
3mo
Drive Advanced Place & Route (APR) and physical verification (PV) signoff for high-performance CPU cores in 3nm and other leading-edge technology nodes.
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SOC Clock Distribution Engineer
NVIDIA
Israel, Tel Aviv
3mo
Designing and implementing SOC level clock requirements, including partitioning, CDC, trial synthesis, and design quality checks for complex networking chips.
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SoC Clocks Design Automation Engineer
NVIDIA
Israel, Tel Aviv
3mo
Developing and supporting clock-related design flows and methodologies for SoC and networking chips, ensuring efficient and high-quality design implementation.
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Hardware Engineer (Switch/Cloud Gateway)
Ubiquiti
Taipei
3mo
Design next-generation Ethernet hardware including Cloud Gateways, Gateway Routers, and Switches.
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Principal SOC Physical Verification & Integration Specialist
Enchargeai36
India
3mo
Drive physical assembly and signoff of next-generation SOCs from floorplan to tapeout, ensuring seamless integration of massive multi-hierarchical blocks.
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Functional Safety Architect
Altera
San Jose, California, United States
$149k
3mo
Lead functional safety activities and device safety architecture for next-generation semiconductor devices across Avionics, Space, Defense, Automotive, and Industrial markets.
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GPU Physical Design Engineer, STA/Timing
Apple
Austin, United States of America
3mo
Design and manufacture high-performance, power-efficient processors by ensuring timing closure for complex GPU designs.
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Principal SoC Architect (f/m/div)
Infineon
Munich
3mo
Define requirements and specifications for System-on-Chip (SoC) architectures, integrating standard IP blocks and developing digital power control algorithms using AI-driven methodologies.
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Design Implementation Synthesis Engineer, Staff / Sr Staff
Qualcomm
Bangalore, India
3mo
Staff/Sr Staff engineer responsible for physical synthesis, timing closure, and low-power design implementation for hardware chips.
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Synthesis Engineer, Lead/Staff/Sr Staff
Qualcomm
Bangalore, India
3mo
Lead a high-performing team of engineers in the implementation domain for the Display Sub-System, focusing on physical synthesis, timing closure, and low-power design optimization for cutting-edge mobile products.
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GPU Physical Design Engineer, STA/Timing
Apple
Austin, United States of America
3mo
Design and manufacture high-performance, power-efficient processors by ensuring timing closure for complex GPU designs.
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GPU Physical Design Engineer, STA/Timing
Apple
Austin, United States of America
3mo
Lead Static Timing Analysis (STA) and timing closure for high-performance, power-efficient GPU processors in Apple products.
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Physical Design Implementation and STA Lead
Altera
San Jose, California, United States
$149k
3mo
Lead physical design implementation and static timing analysis (STA) for next-generation FPGA SoCs, driving closure from floorplanning through signoff.
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SoC Physical Design Engineer, PnR
Apple
Austin, United States of America
3mo
Lead physical design implementation from RTL to GDS for high-performance, low-power SoCs, focusing on timing closure, area, and power optimization.
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IC Design Engineer
Silabs
Singapore
3mo
Designing digital circuits and integrating them into System-on-Chip (SoC) infrastructure for low-power wireless connectivity solutions.
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Sr Engineer - Physical Design
SiFive
Bengaluru, Karnataka, India
3mo
Senior Physical Design Engineer responsible for end-to-end RTL-to-GDS implementation of next-generation IPs, optimizing Power, Performance, and Area (PPA) at the convergence of microarchitecture and physical layout.
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Staff Digital Design Engineer
Renesas-Electronics
Chandler, Arizona, us
3mo
Architecting, designing, and integrating low-power digital circuits for mixed-signal data conversion and power management products in advanced process nodes.
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Principal Hardware Engineer, AI Systems
Microsoft
United States, Washington, Redmond
3mo
End-to-end technical owner for next-generation AI and GPU platforms from architecture handoff through production deployment and fleet readiness.
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Senior Silicon Engineer
Microsoft
United States, California, Santa Clara
3mo
Designing modules for programmable silicon implementation and microarchitecture within a datacenter DPU silicon team.
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Sr. Staff Physical Design Timing Engineer (STA)
Lightmatter
Mountain View, CA
CA$191k
3mo
Drive backend digital execution and timing closure for leading-edge silicon photonics chips in extreme-scale data centers.
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Staff Physical Design Engineer
Lightmatter
Mountain View, CA
$196k
3mo
Implementing complex digital blocks for high-performance ASICs in advanced process nodes (3nm), focusing on timing closure, power integrity, and physical verification for photonics engines.
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Staff Engineer, Physical Design
Renesas-Electronics
Remote
3mo
Lead MCU/subsystem/block-level physical design closure efforts for complex hierarchical SoCs, focusing on timing, congestion, power integrity, and implementation.
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Staff Board Package Design Engineer
Renesas-Electronics
Hyderabad, in
3mo
Lead board and package design for high-performance SOCs/MCUs from block level to final delivery.
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Senior Physical Design Engineer
Microsoft
India, Karnataka, Bangalore
3mo
Senior Physical Design Engineer responsible for physical design implementation and integration of cutting-edge semiconductor products at block, subsystem, sub-chip, and full-chip levels.
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Principal Physical Design Engineer
Microsoft
India, Karnataka, Bangalore
3mo
Leading physical design implementation and integration for cutting-edge semiconductor products at block, subsystem, sub-chip, and full-chip levels.
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NoC (RTL) Design-Sr Lead/Staff/Sr Staff
Qualcomm
Bangalore, India
3mo
Definition, design, and verification of next-generation Network-on-Chip (NoC) and interconnect fabrics for Qualcomm SoCs powering smartphones, notebooks, smart glasses, automobiles, and servers.
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Principal Hardware ASIC Architect engineer
Nxp
Hyderabad
3mo
Define and own architecture for compute, memory, interconnect, and high-speed interface subsystems in AI inference chips, balancing performance, power, and area (PPA) from concept through silicon.
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Design Engineer II
Cadence
HYDERABAD
3mo
Developing, automating, and maintaining EDA flows and scripts for physical implementation of IP cores and soft controllers to optimize performance and power.
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Senior STA Engineer
MediaTek
Austin, TX
3mo
Senior STA Engineer responsible for timing sign-off, constraint development, and margin methodology for mobile CPU blocks in next-generation SoCs.
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Associate Staff/Staff Implementation Design Engineer
Silabs
Singapore
3mo
Leading and hands-on execution of backend (BE) implementation flow for high-performance SoCs and ASICs, ensuring timing closure and PPA optimization.
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ASIC Implementation Engineer PD
Broadcom
USA-CA San Jose Innovation Drive
$122k
3mo
ASIC top level floorplan Physical Design Engineer responsible for taking RTL to silicon tape-out for AI and PCIe Switch products.
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Senior Principal Engineer for Platform Architecture (f/m/div)
Infineon
Munich (Germany)
3mo
Define scalable architecture solutions for next-generation microcontroller platforms, including compute clusters, memory interfaces, and AI/graphics accelerators.
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RTL Design (Director)
Qualcomm
Hyderabad, Telangāna, India
3mo
Director of RTL Design leading SoC architecture, design, and verification strategies for complex hardware products.
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Functional Safety Architect
Altera
Bengaluru, Karnataka, India
3mo
Own device safety architecture and lead efforts to achieve safety goals by developing technical safety concepts and allocating decomposed safety requirements for next-generation semiconductor devices.
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Principal High-Speed I/O Architect (PCIe, CXL, UA Link)
Arm
Austin, Texas
$250k
3mo
Design and define innovative on-chip interconnect architectures (coherent and non-coherent) for scalable SoC platforms across mobile, automotive, datacenter, networking, and IoT markets.
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Principal Platform Power and Performance Engineer
Microsoft
United States, Washington, Redmond
3mo
Lead technical strategy and optimization for silicon and platform power-performance architecture, focusing on AI infrastructure, datacenter efficiency, and workload characterization.
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Engineer, Firmware Design
Micron
Hyderabad - Phoenix Aquila, India
3mo
Design and validation of on-chip controller and mixed signal circuitry in NAND FLASH chips.
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Senior Engineer, Digital Design Engineer
Analogdevices
US, MA, Wilmington
$117k
3mo
Lead methodology improvements for physical design flows across complex chip and SoC programs to enhance scalability, reuse, efficiency, and predictability.
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Principal Engineer, Digital IC Design and Architecture
Analogdevices
US, OR, Beaverton
$157k
3mo
Architect and design digital blocks and subsystems for high-speed SerDes ICs, driving next-gen automotive connectivity standards and enabling data transport for autonomous driving and digital cockpits.
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Firmware Design Engineer
Cadence
MOUNT-ROYAL (Montreal), CA
CA$74k–CA$137k
3mo
Developing physical IP for industry-standard high-speed serial-link protocols, specifically firmware for SERDES PHYs.
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RTL Design(Peripheral)-Sr Staff
Qualcomm
Bangalore, India
3mo
Plan, design, optimize, verify, and test highly critical electronic systems, circuits, and integrated circuitry for next-generation connected products.
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Senior ASIC Design Engineer
NVIDIA
US, CA, Santa Clara
$168k
3mo
Implement, document, and deliver high-performance, area, and power-efficient RTL for NVIDIA's leading SoCs and GPUs, focusing on micro-architecture, scheduling, and interconnects.
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Engineer, Firmware Design
Micron
Hyderabad, Telangana, India
3mo
Design and validation of on-chip controller and mixed signal circuitry in NAND FLASH chips, including architecture development, transistor-level design, and firmware code development.
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Principal NoC IP Micro-Architect
Altera
San Jose, California, United States
$210k
3mo
Designing and leading the end-to-end architecture, microarchitecture, and RTL development of scalable Network-on-Chip (NoC) IP solutions for next-generation FPGA platforms.
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Digital IC Design Engineer (INT TRX)
Texas Instruments
Dallas, TX, United States
3mo
Architect and design high-performance digital circuits interfacing with analog systems for automotive and industrial applications.
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System Architect for Advanced Memory System Architecture- DMTS/SMTS
Micron
Bengaluru, India
3mo
Designing next-generation memory and storage subsystem architectures for AI, servers, and mobile systems, optimizing power and performance through system-level simulation and modeling.
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Staff SSD Hardware PCIe Engineer
Micron
Boise, ID - Main Site
$138k
3mo
Developing modern SSD controller technologies and implementing high-impact solutions for performance and reliability.
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Principal ASIC Architect
Tensordyne
Remote
3mo
Lead architectural planning and definition of next-generation ASIC processors for generative AI inference acceleration, including specialized compute cores, embedded memory, RISC-V CPUs, and high-speed interconnects.
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Sr Staff Engineer, SoC RTL Design
Tenstorrent
Boston
3mo
Define, build, and optimize high-performance IP and SoC architectures for next-gen AI and compute workloads.
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