Technology Development & Process Integration at Micron Jobs
About Micron
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. The Global Procurement (GP) team is an integral engine to Micron’s growth, delivering best‑in‑class total cost and supply chain resiliency through cutting‑edge predictive capabilities, risk analysis, and a focus on sustainability and diversity. Our business goals are directly tied to the value we
177 Open Roles
177 open roles · apply directly
- New College Grad · Minneapolis, MN
- Intern - F10 Process and Equipment Engineer · Singapore, Singapore
- Engineer, STPG PE System · Penang, Malaysia - Grande
- Senior Engineer, Node Development PE · Boise, Idaho, United States of America
- Intern - Semiconductor Research & Technology Development · Albany, NY
- Lead RDA Engineer · Hyderabad - Phoenix Aquila, India
- Staff HBM PYE Product Development Failure Analysis Engineer · Boise, Idaho, United States of America
- New College Grad - Process Integration Engineer · Boise, Idaho, United States of America
- Senior/Staff/Principal - Adv Pkg TD Integrator · Taichung - MTB, Taiwan
- New College Grad - Photomask BEOL Sustaining Engineer · Boise, ID - Main Site
- New College Grad - IT Software Support Engineer · Boise, ID - ID1
- Engineer, DRAM PI · Boise, ID - Main Site
- Intern - Photomask Sustaining Engineering · Boise, ID - Main Site
- New College Grad - Device Process Integration Engineer - CMOS · Boise, ID - Main Site
- TPG IE Operations Engineer · Boise, ID - Main Site
- STAFF/PRINCIPAL ENGINEER - NAND PRODUCT DEVELOPMENT ENGINEER · Fab 10N/X, Singapore
- Senior/ Staff/ Principal - Silicon Design Validation Engineer · Hyderabad - Phoenix Aquila, India
- Staff/Principal Engineer, Product Engineering · Hyderabad - Phoenix Aquila, India
- MTC Shift Equipment Technician · Boise, ID - Main Site
- New College Grad - HBM Product Development Failure Analysis Engineer · Boise, ID - Main Site
- Technology Development, Senior/Staff/Principal Process Development Engineer · Hiroshima - Fab 15, Japan
- Senior Engineer, Technology - AMAIS · Boise, ID - Main Site
- Intern - DRAM Technology DTCO & PPA Assessment Engineer · Boise, ID - Main Site
- Intern - EUV Lithography · Boise, ID - Main Site
- Intern - Mask Technology · Boise, ID - Main Site
- Staff Engineer, NAND Product Engineering · Fab 10N/X, Singapore
- Intern - ADV DRAM Process Integration Engineer · Boise, ID - Main Site
- Intern- MSB Process Integration Engineer · MSB, Singapore
- Principal/MTS Vapor/Thermal Etch Development Engineer, Advanced DRAM Wet Etch · Boise, ID - Main Site
- Intern - Product Development Engineer · Singapore, Singapore
- Intern - Metrology Process Development Engineer · Boise, Idaho, United States of America
- SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI · Fab 10A, Singapore
- Senior Member of Technical Staff, Advanced DRAM Overlay Engineer · Boise, ID - Main Site
- 2027 Summer Intern: Advanced Spectroscopy and Nanoscale Materials Characterization · Boise, Idaho, United States of America
- CMP Manager - ATE · Boise, ID - Main Site
- Intern - Photomask Wet Process Engineering · Boise, Idaho, United States of America
- Senior Process Integration DRAM, PI Technician · Boise, ID - Main Site
- Workforce Development Specialist, TPG Onboarding · Hyderabad - Phoenix Aquila, India
- Intern · Boise, ID - Main Site
- Dry Etch MDE Shift Engineer · Boise, ID - Main Site
- Intern - DRAM Process Integration · Boise, ID - Main Site
- Intern - Wafer Bonding Process Development · Boise, ID - Main Site
- DRAM Device & Process Modeling Engineer · Boise, ID - Main Site
- R&D Thin Films Process Development Engineer Advanced DRAM · Boise, ID - Main Site
- STAFF ASIC Design Engineer · Hsinchu - Chang Yih, Taiwan
- Process Engineer, Photomask Inspection · Boise, ID - Main Site
- Photolithography Advanced DRAM Process Development · Boise, ID - Main Site
- Night Shift TEM Engineer · Fab 10N/X, Singapore
- STAFF ENGINEER, DRY ETCH DRAM · Boise, ID - Main Site
- SR ENGINEER, Software Development SMAI · Hyderabad - Phoenix Aquila, India
- Senior / Principal Layout Engineer – Module Architecture (Pathfinding) · San Jose, CA
- MTS Lead DRAM Device Engineer · Boise, ID - ID1
- Staff / Principal Wafer Bond Process Development Engineer · Boise, ID - Main Site
- Engineer, Node Development PE · Boise, Idaho, United States of America
- Technology Development, Research & Innovation Internship (Singapore) · Fab 10N/X, Singapore
- OPC Production Engineer · Jalisco, Mexico
- ASIC Design Verification Engineer · Minneapolis, MN
- EUV Lithography Process Development Engineer- TPG · Boise, ID - Main Site
- STAFF/PRINCIPAL ENGINEER - CMP PROCESS DEV · Fab 10N/X, Singapore
- ENGINEER, DESIGN · Avezzano (AQ), Italy
- Sr Engineer, Photo DRAM · Boise, ID - Main Site
- R&D Equipment Development Engineer-Photolithography Track · Boise, ID - Main Site
- Senior Engineer, Process Development, CMP · Fab 10N/X, Singapore
- Sr. Node Development Product Engineer - DRAM Technology · Boise, ID - Main Site
- TD CVD/DIFF/IMPLANT Process MDE Manager (Process Development Support) · Boise, ID - Main Site
- Front End CPIE Process Integration (PI) Member of Technical Staff(MTS) · Fab 10A, Singapore
- Senior Engineer, Advanced Structure and Stress Modeling · Hyderabad - Phoenix Aquila, India
- Photo MDE Principal Lead Engineer · Boise, ID - Main Site
- STAFF ENGINEER/PRINCIPAL ENGINEER - PD SG WET PROCESS · Singapore, Singapore
- Process Integration Engineer · Boise, ID - ID1
- SMTS / DMTS – NAND Process Pathfinding - Thin Films & Materials · Fab 10N/X, Singapore
- SMTS, Design Rule Enablement Team TPG · Hiroshima, Japan
- Principal Engineer / MTS – NAND Process Pathfinding - Thin Films · Fab 10N/X, Singapore
- SMTS/DMTS – NAND Process Pathfinding – Wet Etch · Fab 10N/X, Singapore
- Principal Engineer / MTS – NAND Process Pathfinding – Dry Etch · Fab 10N/X, Singapore
- Principal Engineer – NAND Process Pathfinding – Dry Etch · Fab 10N/X, Singapore
- Communications Specialist DRAM · Boise, ID - Main Site
- Senior Embedded Firmware Engineer · Boise, ID - SIG Building
- Senior Engineer · Jalisco, Mexico
- Manager, STPG PE IE · Penang, Malaysia - Grande
- Process & Equipment Engineer · Singapore, Singapore
- Member of Technical Staff (MTS) – 3D NAND Process Integration · Fab 10N/X, Singapore
- Staff/Lead Embedded Software Engineer · Hyderabad - Phoenix Aquila, India
- Sr. Systems Software Engineer · Hyderabad, Telangana, India
- Frontend Central Product Integration Engineering (cPIE) AI Transformation Skill Management Engineer · Singapore, Singapore
- Process Integration Manager · Taichung - Fab 16, Taiwan
- Senior/Staff STPG Product Engineering - Probe · Singapore, Singapore
- SMTS Process Engineer, RET OPC · Boise, ID - Main Site
- Senior/Staff Engineer STPG Product Engineering - Probe · Fab 10N/X, Singapore
- NAND TD RDA PROCESS LEAD · Hyderabad - Phoenix Aquila, India
- Principal Engineer, Region E, Operations Central Teams Advanced Development Team · Hiroshima - Fab 15, Japan
- Senior/Engineer STPG Product Engineering - Probe · Fab 10N/X, Singapore
- Front End Central Product Integration (FE cPIE) Principal Engineer · Taoyuan - Fab 11, Taiwan
- Sr BEOL Engineer - DRAM Process Integration · Boise, ID - Main Site
- Metrology Process Engineer – Technology Development · New York - Remote (B)
- Senior/Principal Eng, FE OCT CPEE Photo EUV Track, Material & Cost Excellence · Boise, ID - ID1
- Senior, STPG PE System · Penang, Malaysia - Grande
- Senior/Staff Product Development · Hyderabad, Telangana, India
- Principal Engineer, Frontend Organizations Central Team, Dry Etch Process · Hiroshima, Japan
- PI Conversion Coordinator Engineer · Fab 10N/X, Singapore
- Staff Engineer, Scribe Layout Design · Hyderabad - Phoenix Aquila, India
- Principal Engineer, Frontend Organizations Central Team, Wet Process · Hiroshima, Japan
- Principal Engineer Lead - Track and Trim Equipment Dev · Boise, ID - Main Site
- Principal Engineer Photolithography DRAM Process Development (Evergreen) · Boise, Idaho, United States of America
- Product Development Engineer · Boise, ID - Main Site
- SENIOR ENGINEER, F10 TD PLANNING SIC · Singapore, Singapore
- Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen) · Boise, ID - Main Site
- Memory Design Engineer | HBM - TPG · Richardson, Texas, United States of America
- NAND Cell Device Senior/Principle Engineer · Fab 10N/X, Singapore
- Senior/Staff, Data Scientist · Fab 10A, Singapore
- Design layout Engineer · Avezzano, L'Aquila, Italy
- Design/Senior Design Engineer – NAND Core (NVE Engineering) · Avezzano, L'Aquila, Italy
- APTD SG TD Integrator · Taichung - MTB, Taiwan
- Engineer-Wet Process Equipment Development · Boise, ID - Main Site
- Senior Engineer, Advanced Modeling & AI Solutions · Boise, ID - Main Site
- Senior or Staff Engineer, Advanced Modeling & AI Solutions · Boise, ID - Main Site
- TEM Engineer · Boise, ID - Main Site
- Director, Business Operations - STPG · San Jose, CA, US
- PRINCIPAL ENGINEER, NAND PI · Singapore, Singapore
- Sr Process Integration Engineer, DRAM · Boise, ID - Main Site
- Product Development Team Lead · Fab 10N/X, Singapore
- DMTS, NAND PI · Singapore, Singapore
- SR ENGINEER, DDEG DESMETH DFT · Hyderabad, Telangana, India
- Staff Engineer, Equipment Development, DIFI · Fab 10N/X, Singapore
- Systems Software Engineer, (Linux, CUDA) · Richardson, TX
- Staff / Principal Engineer, STPG PE System · Penang, Malaysia - Grande
- Principal Engineer - ASIC DV · Bengaluru, India
- Advanced Technology Japan Engineer, WoW Bonding · Hiroshima, Japan
- Frontend Central Product Integration Engineering (CPIE) Engineer/ Senior Engineer · Fab 10A, Singapore
- Senior / Principal Engineer, NAND Product Engineering · Singapore, Singapore
- Staff Engineer, NAND TD, RDA · Singapore, Singapore
- Senior / Principal DRAM Product Development Engineer – DEG Technology · Boise, ID - Main Site
- Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer · Singapore, Singapore
- Staff CAD Design Automation Engineer · Boise, ID - Main Site
- Staff ENGINEER - CE CAD · Richardson, TX
- Dry Etch Process Develop Engineer · New York - Remote (B)
- FE CPIE PI Principal/Staff Engineer · Boise, ID - ID1
- Senior Engineer, CAD · Hyderabad - Phoenix Aquila, India
- Principal Node Development Product Engineer, DPAG · Boise, ID - Main Site
- R&D Dry Etch Process Development Engineer · Boise, ID - Main Site
- High NA EUV Track - Equipment Engineer · New York - Remote (B)
- Senior Member of Technical Staff (SMTS) – Process Development, CMP, NAND · Singapore, Singapore
- Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND · Singapore, Singapore
- Principal Engineer, Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) · Fab 10A, Singapore
- Films Process Development Engineer · New York - Remote (B)
- Senior Member of Technical Staff (SMTS) – Process Development, Thin Films (CVD/Diffusion), NAND · Singapore, Singapore
- STPG NAND Product Development Senior/ Engineer · MSB, Singapore
- Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND · Singapore, Singapore
- Technology and Development (TD) IE Planner · Boise, Idaho, United States of America
- TD Photolithography Automation Engineer · Boise, Idaho, United States of America
- Staff/ Principal Engineer, OCT MTE Material Engineering · Boise, Idaho, United States of America
- Pathfinding Device Integration Engineer · Boise, ID - Main Site
- Sr. Design Verification Engineer · Minneapolis, Minnesota, United States of America
- CMOS Device Integration Team - DMTS · Boise, ID - Main Site
- Front End Central Product Integration (FE cPIE) Principal Engineer/Senior Manager · Fab 10A, Singapore
- Staff Engineer, TEM · Fab 10N/X, Singapore
- High NA EUV - Scanner Engineer · New York - Remote (B)
- Principal Product Architect · Boise, ID - Main Site, US
- SMTS Product Architect · Boise, ID - Main Site, US
- Principal Engineer/MTS, Process Development, Photolithography, NAND · Fab 10N/X, Singapore
- FE Central Product Integration Engineering (CPIE) Senior/ Staff Engineer · Taoyuan - Fab 11, Taiwan
- Frontend Central Process Integration Senior Engineer · Boise, ID - ID1
- Staff Design Engineer · Tokyo, Japan
- Senior/Principal Dry Etch Engineer · Boise, ID - Main Site
- Wet Process · Singapore, Singapore
- Principal/Staff Process Integration Engineer · Hiroshima, Japan
- Senior NAND Reliability Product Engineer · Fab 10A, Singapore
- RDA and Metrology Central Team Engineer · Hiroshima, Japan
- Photolithography Staff/Sr Engineer, Process Development, Advanced NAND · Fab 10N/X, Singapore
- Principal Diffusion Process Development Engineer, DRAM · Boise, ID - Main Site
- Senior/Staff HBM PYE Product Development Failure Analysis Engineer · Boise, ID - Main Site
- Realtime Defect Analysis Engineer · Boise, ID - Main Site
- Sr. Engineer, Photo DRAM · Boise, ID - Main Site
- Senior/Staff/Principal Engineer, Product Engineering · Hyderabad - Phoenix Aquila, India
- Frontend Organizations Central Team, Staff / Principal Photo Scanner Engineer · Fab 10A, Singapore
- Principal/Staff Engineer, PCVD Film Deposition, TD · Fab 10N/X, Singapore
- Senior Engineer, Process Integration, Advanced NAND · Fab 10N/X, Singapore
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