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Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen)

Boise, ID - Main Site💼 Full-time🗓 2026-06-15 → 2026-07-31

Core

Lead process engineering initiatives for thin films deposition in Advanced DRAM nodes, focusing on high-aspect-ratio, electrically sensitive, high-density devices.

Role type

Senior IC process development engineer (semiconductor manufacturing)

Builds

Advanced DRAM memory and storage solutions

Domain

Semiconductor manufacturing / Thin films deposition

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Failure analysis, FMEA, SPC/FDC, process troubleshooting, yield improvement, cost reduction, supplier management, new product introduction, cross-functional collaboration

Preferred skills

APC, RMS, automated process control systems, supplier quality audits

Technologies

Thin films deposition tools, APC systems, RMS systems

Responsibilities

Diagnose and resolve assembly process issues using structured methods; Lead process, equipment, and material evaluations; Drive yield improvement, cost reduction, and productivity initiatives; Validate and scale new process baselines, tools, and materials; Manage and audit suppliers

Seniority

Senior, hands-on IC

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