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Principal Engineer Lead - Track and Trim Equipment Dev

Boise, ID - Main Site💼 Full-time🗓 2026-06-16 → 2026-08-01

Core

Lead technical programs for photolithography Track and Trim systems to ensure equipment performance, yield, and cost targets in advanced semiconductor manufacturing.

Role type

Principal Engineer Lead, Semiconductor Equipment Development

Builds

Next-generation lithography capabilities including EUV for high-volume manufacturing

Domain

Semiconductor manufacturing, Photolithography

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Photolithography Track systems expertise, Equipment lifecycle management, Process strategy definition, Complex technical problem solving, Vendor partnership, Safety protocol implementation

Preferred skills

EUV technology experience, Lithography Edge Trim equipment/process knowledge, High-volume manufacturing performance improvement

Technologies

EUV, Track and Trim systems

Responsibilities

Serve as SME for Track & Trim systems defining process strategy and resolving complex issues; Lead equipment lifecycle programs from selection to deployment; Improve tool uptime and reliability to meet yield and cost targets; Drive safety and operational perfection; Partner with multi-functional teams and vendors to scale solutions

Seniority

Principal, technical leadership & program management

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