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Principal Engineer, Frontend Organizations Central Team, Wet Process

Hiroshima, Japan💼 Full-time🗓 2026-06-18 → 2026-09-25

Core

Lead process optimization, yield improvement, and cost reduction for semiconductor wet process equipment and chemistry.

Role type

Principal Engineer, Semiconductor Manufacturing (Wet Process)

Builds

Semiconductor memory and storage products (DRAM, NAND, NOR)

Domain

Semiconductor manufacturing / Chemical Mechanical Planarization / Wet Process

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor process management, Hardware CIP roadmap development, Equipment start-up acceptance criteria, Abnormal analysis, Process parameter establishment, Tool performance maturation, Cross-functional collaboration, Supplier management, Safety and sustainability standards adherence

Preferred skills

Materials Science background, IoT sensor implementation for tool defense, Energy and water conservation solutions

Technologies

Wet Process tools (SWC, Bench, Scrub, Backside, Bevel), IoT sensors, CIP systems

Responsibilities

Strategize and lead productivity, yield, quality, and cost improvement engagements globally; Collaborate on breakthrough defect reduction and particle removal efficiency; Develop roadmaps for process and hardware CIP implementation; Drive process and hardware improvement with emphasis on safety, quality, and sustainability; Establish equipment start-up acceptance criteria and tool service requirements; Improve tool efficiency through benchmarking; Set up IoT sensors for tool defense and excursion prevention; Upgrade process capability and reduce production costs; Enable energy savings, water conservation, and waste reduction solutions.

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