SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI
Core
Drive packaging product yield, quality improvement, and new product introduction (NPI) for silicon nodes by integrating front-end manufacturing processes and leveraging AI-enabled engineering approaches.
Role type
Senior IC Central Process Integration Engineer (Packaging)
Builds
High-performance DRAM and advanced packaging solutions for data centers, AI, and mobile applications
Domain
Semiconductor manufacturing (DRAM, BEOL integration, advanced packaging)
Deliverable
production ML models | product features
Required skills
Semiconductor device physics, DRAM operations, wafer fabrication process flows, parametric/electrical test, probe yield, BEOL integration, advanced packaging, layout, data analysis, root cause analysis, project management, business process re-engineering
Preferred skills
AI-enabled productivity tools, digital collaboration platforms, strategic thinking, cross-functional collaboration
Technologies
Microsoft Office, Microsoft Copilot, AI-powered tools, data analytics, automation solutions
Responsibilities
Lead PI Loop taskforce to address yield and quality challenges, define strategies for packaging technology qualification ahead of product qualification, promote worldwide synergy through global project management and BKM leveraging, maintain domain knowledge and explore innovation opportunities, drive AI and digital transformation initiatives to enhance engineering efficiency
Seniority
Senior, hands-on IC
