APTD SG TD Integrator
Core
Developing advanced packaging process solutions and ensuring success for new processes, equipment, materials, and pathfinding activities for advanced packaging products.
Role type
Senior IC process integrator (advanced packaging)
Builds
New packaging process solutions, qualification, and production launch for advanced memory/storage products
Domain
Semiconductor manufacturing, advanced packaging, memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Frontend fab process integration, module process technology, wafer and die level process technology, CPI (Chip-to-Package Integration), process characterization and optimization, risk mitigation, project management, cross-functional collaboration
Preferred skills
Understanding of future packaging trends and capabilities, creative problem solving for process constraints, strategic roadmap definition
Technologies
Advanced packaging equipment, new materials, new process technologies
Responsibilities
Develop and qualify new packaging process, material, equipment, and technology solutions; Perform CPI NUDD, process TRA, and risk mitigation; Ensure smooth transition from development to small volume production; Integrate process knowledge between upstream and downstream across Si and assembly/packaging; Define and establish process capabilities and strategy
Seniority
Senior, hands-on IC
