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Films Process Development Engineer

New York - Remote (B)💼 Full-time💰 $107,000–$107,000🗓 2026-05-07 → 2026-07-31

Core

Develop and integrate thin film deposition processes for next-generation EUV-enabled DRAM technology, owning concepts from early development through high-volume manufacturing.

Role type

Senior IC process development engineer (semiconductor thin films)

Builds

Manufacturable memory technology (DRAM) for global clients

Domain

Semiconductor manufacturing / Materials science

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Thin film physics, materials science, chemical reaction engineering, process characterization, defect reduction, SPC, process maturity analysis

Preferred skills

EUV patterning film development, surface analysis techniques (XPS, AFM, XRD, SIMS), vendor equipment roadmap leadership, cross-functional team leadership

Technologies

ALD, CVD, PECVD, PE-ALD, LPCVD, EUV patterning

Responsibilities

Develop and optimize thin film deposition processes for EUV-enabled DRAM; Lead process characterization, troubleshooting, and defect reduction through VME; Drive thin film roadmap activities aligned to future technology nodes; Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions; Analyze large physical and electrical datasets and communicate clear recommendations

Seniority

Senior, hands-on IC

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