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Senior/Staff HBM PYE Product Development Failure Analysis Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-03-16 → 2026-07-30

Core

Perform electrical and statistical failure analysis on next-generation HBM devices to identify fabrication and assembly defects, enabling rapid production ramp and early time to market.

Role type

Senior/Staff Product Development Failure Analysis Engineer (HBM)

Builds

High Bandwidth Memory (HBM) devices for data centers and AI applications

Domain

Semiconductor manufacturing / Memory and storage solutions

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

electrical failure analysis, statistical failure analysis, electrical characterization, physical characterization, data analysis, AI tools for failure analysis, cross-functional coordination

Preferred skills

VLSI knowledge, device physics, semiconductor processes, Python, statistics, AI tools for component failure analysis

Technologies

Python, AI tools

Responsibilities

Perform electrical and statistical failure analysis to understand failure mechanisms; Identify causes of component failures through data analysis; Work closely with partner engineering teams to resolve fabrication and assembly process defect related issues and test flow marginalities; Use AI and statistical tools for detailed data analysis to improve component performance

Seniority

Senior/Staff, hands-on IC

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