Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND
Core
Distinguished Member of Technical Staff leading Cell Film Process Development, specifically Chemical Mechanical Polishing (CMP) for NAND technology, defining long-term strategies and driving breakthrough innovations.
Role type
Distinguished Member of Technical Staff (DMTS), strategy-level IC
Builds
Next-generation CMP process innovations, hardware roadmaps, and technology roadmaps for NAND memory
Domain
Semiconductor manufacturing, Memory (NAND), Chemical Mechanical Polishing (CMP)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP process development, pad–slurry–wafer interactions, mechanistic slurry chemistry, pattern density/layout effects, statistical process control (SPC), data analysis, process qualification methodologies, supplier technical reviews, hardware roadmap decisions
Preferred skills
AI tool integration, cross-functional leadership, executive-level communication
Technologies
300 mm CMP OEM platforms, FOAK developments, recipe architecture
Responsibilities
Define long-term technology and equipment strategies for CMP; Architect and drive next-generation CMP process innovation; Lead resolution of complex yield, defectivity, and integration challenges; Define and execute CMP hardware and supplier roadmaps; Provide forward-looking technical leadership on scaling risks; Mentor senior engineers; Represent CMP technology in external forums
Seniority
Distinguished Member of Technical Staff (DMTS), strategy & mentorship
