Principal/Staff Process Integration Engineer
Core
Lead module development for next-generation DRAM technology nodes, defining structural and electrical requirements and integrating modules across the process flow.
Role type
Principal/Staff Process Integration Engineer (DRAM Technology Development)
Builds
Next-generation DRAM modules and processes
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, Electrical characteristics evaluation, Materials science, Semiconductor process fundamentals, JMP, Python, Statistical analysis, Cross-functional collaboration, Technical documentation, Yield improvement strategies
Preferred skills
5+ years in process integration, 2+ years in DRAM fab or DRAM transfer team, Front End/Middle of Line/Interconnect experience, Device physics background, Fluent Japanese
Technologies
JMP, Python
Responsibilities
Define structural and electrical specifications for one or more modules; Design, execute, and analyze experiments to meet engineering specifications based on structure-electrical correlations; Develop and maintain process modules including alternative flows; Optimize existing process flows to meet product requirements; Extract, monitor, and analyze inline, defect, parameter, and probe data to drive yield, performance, reliability, and cost improvements; Collaborate cross-functionally with design, product technology, modeling, and quality teams; Define sub-milestones within the assigned module; Maintain communication between process integration, process development, and pilot fab; Ensure timely documentation of R&D activities for manufacturing transfer.
Seniority
Principal/Staff, hands-on IC with strategic oversight