Member of Technical Staff (MTS) – 3D NAND Process Integration
Core
Drive 3D NAND integration and technology roadmap by bridging device concepts, materials, and process integration into manufacturable solutions using AI-enabled data analytics.
Role type
Senior IC semiconductor process integration engineer (3D NAND)
Builds
Next-generation memory technologies and manufacturable solutions for data centers and AI applications
Domain
Semiconductor manufacturing / 3D NAND memory / Materials science
Deliverable
production ML models | product features
Required skills
Semiconductor device physics, process integration, experiment design, data analysis, cross-functional collaboration, AI-assisted problem solving
Preferred skills
Memory technology experience (NAND/DRAM), advanced data analytics, AI/ML techniques, patent/publication experience
Technologies
AI-enabled tools, model-driven methodologies, characterization equipment
Responsibilities
Drive 3D NAND integration and technology roadmap; Lead end-to-end development from conception to technology validation; Solve complex integration challenges using data-driven approaches; Define and optimize module/process architecture; Collaborate across Device, Probe, Test, Design, and Operations teams; Drive technical innovation through process improvements and patents
Seniority
Senior, hands-on IC