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STAFF ENGINEER, DRY ETCH DRAM

Boise, ID - Main Site💼 Full-time🗓 2026-07-29 → 2026-09-26

Core

Develop and optimize dry etch processes for next-generation DRAM devices, bridging research and development to manufacturing implementation.

Role type

Staff Engineer, Semiconductor Process Development (Dry Etch)

Builds

High-performance memory devices and storage solutions

Domain

Semiconductor manufacturing, Plasma physics, Device integration

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

dry etch process development, plasma physics, dry etch chemistries, reactor fundamentals, statistical methods, SPC, data-driven problem solving, project management

Preferred skills

DRAM process ownership, ICP and CCP dry etch systems, transport phenomena, surface interactions, FMEA, 8D, advanced defect analysis, AI for data analysis

Technologies

ICP, CCP, SPC

Responsibilities

Develop and optimize dry etch processes to meet structural and electrical requirements; Collaborate with integration and process teams to solve complex device and process challenges; Perform root cause analysis and drive yield, defect, and process improvements; Analyze data to improve process capability, stability, and manufacturing readiness; Support process transfer, project execution, and production issue resolution

Seniority

Staff, hands-on IC with strategic ownership

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