Staff / Principal Wafer Bond Process Development Engineer
Core
Develop and optimize wafer bonding processes (direct, hybrid, thinning) to enable next-generation DRAM technologies and improve manufacturing yield, quality, and reliability.
Role type
Staff / Principal IC Process Development Engineer (Semiconductor Manufacturing)
Builds
Next-generation DRAM memory chips
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features
Required skills
Wafer bonding process development, DOE methodology, root-cause analysis, cross-functional project leadership, equipment/material qualification, data-driven problem solving
Preferred skills
DRAM technology development, statistical analysis, supplier collaboration, AI/ML tool application
Technologies
Direct bonding, hybrid bonding, wafer thinning, de-bonding, AI/ML tools
Responsibilities
Develop and optimize wafer bonding processes; Plan and execute experiments (DOEs) to improve process performance; Drive yield improvement and cost reduction initiatives; Evaluate and qualify new equipment, materials, and process technologies; Collaborate with manufacturing and suppliers to resolve issues; Use advanced analytics and AI/ML tools to solve complex problems
Seniority
Staff / Principal, hands-on IC with strategic influence
