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Pathfinding Device Integration Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-05-04 → 2026-07-31

Core

Define and advance next-generation memory technologies by bridging novel material systems with actionable process flows to enable future device scaling.

Role type

Pathfinding Device Integration Engineer (R&D)

Builds

Next-generation memory devices and manufacturable technology solutions

Domain

Semiconductor memory and storage

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

semiconductor device physics, process integration, experimental design, data analysis, cross-functional collaboration

Preferred skills

non-conventional device architectures, TCAD modeling, materials characterization, statistical analysis

Technologies

TCAD modeling tools, R&D fab equipment

Responsibilities

Identify and evaluate novel device concepts for performance and reliability; guide technology development and design trade-offs using device physics; integrate device concepts and materials into manufacturable solutions; execute experiments in the R&D fab to validate new architectures; analyze complex datasets from simulation and silicon results to optimize failure mechanisms and variability; collaborate with modeling, characterization, and compose teams to align technical roadmaps

Seniority

Mid-to-Senior, hands-on IC researcher

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