Principal/Staff Engineer, PCVD Film Deposition, TD
Core
Developing and optimizing advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for next-generation memory technologies and device architectures.
Role type
Principal/Staff Engineer, Technology Development
Builds
Next-generation memory technologies (DRAM, NAND, NOR) and advanced device architectures
Domain
Semiconductor manufacturing / Thin film deposition / Materials Science
Deliverable
production ML models | product features
Required skills
ALD, LPCVD, PECVD, PVD process development; Film growth mechanisms and surface chemistry; Plasma physics; Thermodynamics and chemical kinetics; DOE and statistical analysis; TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry; Root-cause analysis and failure mode identification
Preferred skills
TCAD or process simulation tools; Data analytics and machine learning for process optimization; Technology roadmap definition; Strategic research leadership
Technologies
ALD, LPCVD, PECVD, PVD, TCAD, TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry
Responsibilities
Develop and optimize advanced thin film deposition processes; Design and execute complex DOE experiments; Perform root-cause analysis using modeling and characterization; Collaborate with integration, metrology, and equipment engineering teams; Drive innovation in film deposition for performance and cost efficiency; Define technology roadmaps and lead strategic research initiatives; Mentor junior engineers and lead multi-disciplinary technical projects
Seniority
Principal/Staff, hands-on IC with strategic leadership