Front End Central Product Integration (FE cPIE) Principal Engineer
Core
Provide leadership to the global Micron network to drive leading edge HBM Product yield, quality improvement, and new product introduction through technical expertise and project execution.
Role type
Principal Engineer / Senior Manager, Front End Central Product Integration (HBM)
Builds
High Bandwidth Memory (HBM) products for data centers and AI applications
Domain
Semiconductor manufacturing, specifically DRAM and NAND front-end process integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor fabrication process flows, DRAM and NAND operation/structure, model-based problem solving, data-driven decision making, root cause analysis, cross-cultural collaboration, strategic process integration tool development
Preferred skills
AI-enabled tool usage, AI literacy for operational tasks, mentorship and successor development
Technologies
AI-assisted tools, Process Integration systems
Responsibilities
Drive best-in-class yield ramping with FAB, develop strategic process integration roadmaps, conduct metrics reviews of critical group deliverables, provide direct leadership on escalated performance items, establish training roadmaps and develop potential successors, integrate AI tools to improve efficiency and quality
Seniority
Principal/Senior Manager, hands-on technical leadership with people management