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MTS Lead DRAM Device Engineer

Boise, ID - ID1💼 Full-time🗓 2026-07-27 → 2026-09-26

Core

Lead DRAM device development, characterization, and yield improvement to enable successful fab ramps and next-generation memory technology transitions.

Role type

Senior IC device engineer (DRAM)

Builds

Next-generation DRAM memory solutions for high-volume manufacturing

Domain

Semiconductor manufacturing / Memory technology

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor device physics, device characterization, electrical data analysis, statistical analysis, root-cause analysis, cross-functional technical leadership, data-driven problem solving

Preferred skills

DRAM/NAND/NOR memory technology experience, memory architecture and array operation knowledge, margin bin analysis, AI tools for data analytics in semiconductor manufacturing, AI-assisted anomaly detection

Technologies

Semiconductor manufacturing tools, electrical data analysis platforms, AI analytics tools

Responsibilities

Lead DRAM device activities and serve as primary technical point of contact; Drive device characterization and electrical data analysis to improve yield and performance; Support new node introductions and fab ramps through root-cause analysis; Provide technical direction across Process Integration, Product Engineering, Design, Quality, and Failure Analysis teams; Mentor engineers and promote best practices in device analysis and experimentation

Seniority

Senior, hands-on IC with mentorship responsibilities

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