Principal Engineer / MTS – NAND Process Pathfinding – Dry Etch
Core
Architect and deploy next-generation plasma etch solutions to enable future NAND scaling and novel device architectures.
Role type
Principal Engineer / Member of Technical Staff (MTS) – Dry Etch
Builds
Next-generation memory solutions for AI, mobile, automotive, and data center applications
Domain
Semiconductor manufacturing / Advanced NAND process technology
Deliverable
production ML models | product features
Required skills
ICP/CCP plasma etch, plasma-surface interactions, etch chemistry, profile control, plasma physics, process integration, AI/ML engineering tools, statistical modeling, digital workflows
Preferred skills
High aspect ratio etching, advanced pattern transfer, selective etching, complex structure engineering, machine learning, automation, predictive modeling, virtual process modeling, technical leadership, mentoring
Technologies
AI-enabled engineering tools, advanced analytics, digital workflows
Responsibilities
Develop and refine dry etch processes to satisfy NAND roadmap criteria; Guide development of next-generation etch solutions; Evaluate new plasma chemistries, process technologies, and hardware; Collaborate with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, Device, and other teams; Leverage AI-enabled engineering tools and advanced analytics to accelerate process development
Seniority
Principal, hands-on IC with technical leadership