Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer
Core
Coordinate improvements in Yield, Quality, and Output for DRAM/NAND process and production lines by designing experiments and analyzing complex data.
Role type
Process Integration Module Engineer
Builds
DRAM and NAND memory chips
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
experimental design, data analysis, root cause analysis, cross-functional collaboration, process optimization, yield management, statistical analysis, equipment troubleshooting
Preferred skills
semiconductor industry experience, knowledge of DRAM/NAND processes, leadership experience
Technologies
wafer fabrication tools, process control systems, data analytics platforms
Responsibilities
Collaborate with multi-functional teams to improve product yields and reliability; Design, execute, and analyze experiments to optimize fab processes; Collect and interpret complex data to increase yields; Communicate module-related issues to engineering and leadership teams; Engage cross-area engineering teams to tackle process issues; Partner with production and equipment engineering to balance yield and output; Promote network synergy through benchmarking and standardization of best-known methods.
Seniority
Mid-level, hands-on IC
