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RDA and Metrology Central Team Engineer

Hiroshima, Japan💼 Full-time🗓 2026-03-27 → 2026-09-25

Core

Establish and optimize detection systems and strategies for RAM manufacturing to ensure 100% inline visibility and control, driving yield improvement and cost reduction.

Role type

Senior IC process and equipment engineer (RAM detection and metrology)

Builds

Inline detection systems, measurement equipment configurations, and global best-known methods (BKM) for memory manufacturing

Domain

Semiconductor manufacturing (Memory/Storage: DRAM/NAND)

Deliverable

production ML models | product features | dashboards & analysis | infrastructure

Required skills

RDA (Resistive Detection Analysis) expertise, Metrology expertise, Process parameter setup, Supplier management, Project management, Global strategy alignment, BKM development, Equipment evaluation, Yield analysis, Cross-site coordination

Preferred skills

Experience with Tool of Record (TOR) processes, Manufacturing Tool Evaluation Program (MTEP), Technology Development partnership, Global peer group facilitation

Technologies

Inspection and Measurement equipment, RAM manufacturing tools, Supplier tool roadmaps

Responsibilities

Establish 100% inline visibility and control for detection systems; Improve detection strategy, system, and methods to strengthen performance; Set up process parameters for inspection and measurement equipment; Manage global business processes including Tool of Records (TOR) and Model of Records (MOR); Lead Copy Smart Team (CST) to ensure cross-site alignment; Track Fab performance metrics and identify improvement gaps; Partner with suppliers to reduce CapEx and OpEx; Execute abnormal analysis and drive continuous improvement initiatives.

Seniority

Senior, hands-on IC with global network leadership

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