Senior Member of Technical Staff, Advanced DRAM Overlay Engineer
Core
Define overlay specifications, error budgets, and mark strategies for advanced bonding technologies while driving metrology, automation, and AI-based analytics to improve yield and performance.
Role type
Senior IC advanced DRAM overlay engineer (technical leadership & problem solving)
Builds
Advanced DRAM memory and storage solutions
Domain
Semiconductor manufacturing (DRAM), lithography, and wafer bonding
Deliverable
production ML models | product features
Required skills
Overlay strategy and roadmap planning, error budget management, metrology and process control, AI and advanced analytics, simulation and experimental design, supplier engagement, technical mentorship
Preferred skills
None stated
Technologies
None explicitly listed (mentions AI, simulation, metrology tools generally)
Responsibilities
Own the overlay roadmap including bond overlay technologies; define overlay specifications, error budgets, and scaling requirements; develop innovative overlay solutions for advanced bonding; drive advancement of overlay metrology, automation, and analytics; lead simulation and experimental process development; solve complex overlay challenges involving alignment and distortion; provide technical leadership across Process Integration, Lithography, and Bonding teams; lead supplier engagements for next-generation overlay capabilities; mentor engineers to build overlay expertise
Seniority
Senior, hands-on IC with technical leadership
