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TEM Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-06-03 → 2026-07-31

Core

Develop new processes and materials for memory devices using advanced electron microscopy and ion beam techniques to support product transfers and yield improvement.

Role type

Senior IC TEM/FIB engineer (semiconductor materials analysis)

Builds

Memory devices (DRAM) for consumer electronics and data centers

Domain

Semiconductor manufacturing / Materials Science

Deliverable

production ML models | product features

Required skills

Atomic-resolution STEM, EELS, 4D-STEM, FIB sample preparation, Python programming, GMS scripting, data processing automation, machine learning for TEM analysis

Preferred skills

Innovation in lab procedures, independent problem solving, mentoring technical teams

Technologies

Transmission Electron Microscopes (TEM), Focused Ion Beam (FIB), GMS, Python

Responsibilities

Perform daily FIB lamella preparation and TEM analysis (microstructure/chemical), optimize lab procedures, collaborate on new part/module development, develop AI/automation techniques for TEM workflows, enhance data acquisition and processing efficiency

Seniority

Senior, hands-on IC

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