Senior Engineer, Process Development, CMP
Core
Developing and optimizing Chemical Mechanical Planarization (CMP) processes to improve product quality and reliability for next-generation 3D NAND memory parts.
Role type
Senior IC Process Development Engineer (CMP)
Builds
3D NAND memory parts and advanced node technology solutions
Domain
Semiconductor manufacturing / 3D NAND / Chemical Mechanical Planarization
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP equipment operation (AMAT, EBARA), optical metrology, profilometry, polishing slurries/conditioners/pads, dielectrics/metals CMP process development, 300mm wafer fabrication, film deposition integration, AI-assisted tool integration
Preferred skills
Memory processing planar and vertical NAND process flow knowledge, Data science and modeling, AI workflow optimization
Technologies
AMAT (LKP), EBARA-300X, 300mm wafer fabrication tools
Responsibilities
Develop and optimize CMP processes for 3D NAND; Perform fundamental research and hardware evaluation for novel applications; Manage experiments to widen process margins; Collaborate with vendors on integration requirements; Design advanced process monitoring and control methodologies; Mentor new hires on CMP fundamentals; Lead multi-disciplinary projects for yield and cost improvement.
Seniority
Senior, hands-on IC
