Intern - ADV DRAM Process Integration Engineer
Core
Intern role focused on 3D DRAM process integration, device components, and optimizing process flows for next-generation memory scaling.
Role type
Intern, process integration engineer (3D DRAM)
Builds
Next-generation 3D DRAM memory technologies
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device fabrication, electrical characterization, material characterization, process integration, data analysis, modeling
Preferred skills
Data analysis, modeling, collaboration
Technologies
300mm R&D facility tools, inline parametric testing equipment, probe stations
Responsibilities
Contribute to technology development for next-gen DRAM device components; Optimize process flows to meet product requirements; Engage cross-functional teams to solve performance and yield issues; Design and run experiments in the R&D fab; Analyze inline, parametric, and probe data to evaluate failure mechanisms and optimize device performance; Summarize complex problems and drive team implementation of solutions.
Seniority
Intern