Dry Etch Process Develop Engineer
Core
Develop, integrate, and optimize plasma etch processes for next-generation memory devices, working hands-on with etch equipment, chamber hardware, and metrology to improve critical dimension control, profile, selectivity, and uniformity.
Role type
Dry Etch Process Development Engineer
Builds
Advanced memory technologies (dielectric, conductor, hardmask etch) for high-volume manufacturing
Domain
Semiconductor manufacturing / Memory / Plasma processing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE planning and execution, statistical data analysis, plasma etch fundamentals, process characterization (profile, CD, selectivity, uniformity, defectivity), root-cause analysis, cross-functional collaboration
Preferred skills
Hands-on experience with ICP/RIE platforms, chamber matching across fleets, pattern transfer challenges (ARDE, microloading, footing/notching), defect characterization techniques, tool health monitoring, technology transfer to high-volume manufacturing
Technologies
ICP/RIE, metrology tools, SPC, statistical analysis tools
Responsibilities
Develop, qualify, and sustain dry etch unit processes; Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness; Drive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysis; Perform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failures; Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost-of-ownership improvements; Document process baselines, change controls, and learning; communicate results and support technology transfer to high-volume manufacturing
Seniority
Mid-level IC