Staff HBM PYE Product Development Failure Analysis Engineer
Core
Perform electrical and statistical failure analysis on next-generation HBM devices to identify fabrication and assembly defects, enabling rapid production ramp and early time to market.
Role type
Staff HBM Product Yield Enhancement PDFA Engineer
Builds
Next-generation HBM memory devices for mass production
Domain
Semiconductor / High Bandwidth Memory (HBM)
Deliverable
production ML models | product features
Required skills
Electrical failure analysis, Statistical failure analysis, Physical characterization techniques, Data analysis, AI tool usage (Claude/Copilot), JMP statistical software
Preferred skills
VLSI knowledge, Device physics, Semiconductor processes, Python programming, Cross-functional communication
Technologies
JMP, Claude, Copilot, Python
Responsibilities
Perform electrical and statistical failure analysis to understand failure mechanisms; Identify causes of component failures through data analysis; Work with engineering teams to resolve fabrication and assembly process defects; Use AI and statistical tools to improve component performance
Seniority
Staff, hands-on IC