PRINCIPAL ENGINEER, NAND PI
Core
Design, develop, integrate, and implement process solutions to improve next-generation 3D NAND product yield and quality with competitive cost and performance.
Role type
Principal Engineer, NAND Process Integration
Builds
3D NAND semiconductor integrated circuits
Domain
Semiconductor manufacturing / Non-volatile memory
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process integration optimization, Data analysis, Problem-solving, Statistical analysis, Material analysis, Device and process experiment design, Team leadership, Strategic planning, Yield and reliability analysis, Technology transfer
Preferred skills
Scripting/programming (Python), Engineering software (SolidWorks), Business intelligence (Tableau, Power BI), Knowledge of NAND process flow, R&D experience
Technologies
Python, SolidWorks, Tableau, Power BI
Responsibilities
Lead process modules for 3D NAND development, Define structural specifications and process requirements, Set strategic direction and improvement plans, Identify and resolve structure/electrical/reliability issues, Optimize structural development and electrical performance, Analyze materials and drive material changes from research to production, Design and implement device/process experiments, Provide team leadership and coordinate multi-functional teams, Make key decisions and set goals, Innovate to address complex problems and generate IP, Support technology transfer from R&D to manufacturing
Seniority
Principal, hands-on IC with strategic oversight