Principal Engineer / MTS – NAND Process Pathfinding - Thin Films
Core
Architect and deploy next-generation thin film fabrication methods for NAND process technology, focusing on materials, deposition, and device integration to meet structural, electrical, and reliability targets.
Role type
Principal Engineer / Member of Technical Staff (MTS) – Thin Films
Builds
Next-generation NAND memory cells and advanced memory solutions
Domain
Semiconductor manufacturing / Thin film process development
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CVD, LPCVD, PECVD, ALD, PEALD, MOCVD processes; thin film reactor operation; plasma physics; transport phenomena; surface chemistry; new material and deposition method development; vendor management
Preferred skills
Statistical process control (SPC); advanced data analysis; AI and generative AI application in process development; engineering automation; team mentoring
Technologies
CVD, LPCVD, PECVD, ALD, PEALD, MOCVD, AI-enabled engineering tools, advanced analytics
Responsibilities
Advance thin film process development to meet demanding structural, electrical, and reliability targets; Lead the creation of thin films for next-generation NAND cells; Explore new materials, precursor chemistries, and deposition techniques; Partner across Device Engineering, Process Integration, and Yield teams; Lead technical task forces and mentor engineers; Leverage AI-enabled engineering tools and advanced analytics to accelerate process development
Seniority
Principal, hands-on IC with strategic leadership