Front End Central Product Integration (FE cPIE) Principal Engineer/Senior Manager
Core
Leading edge HBM Product yield, quality improvement, and new product introduction (NPI) through technical expertise and business process management.
Role type
Principal Engineer/Senior Manager, Process Integration Engineering
Builds
High Bandwidth Memory (HBM) products for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing, specifically DRAM and NAND fabrication
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor fabrication process flows, DRAM and NAND operation/structure, parametric/probe/qual data analysis, model-based problem solving, data-driven decision making, root cause analysis, cross-cultural collaboration, project execution, strategic roadmap development
Preferred skills
AI-enabled tools usage, AI literacy, digital fluency, mentorship, training roadmap management
Technologies
AI-assisted tools, digital systems
Responsibilities
Drive best-in-class yield ramping with FAB partners, develop strategic Process Integration tools and roadmaps, conduct metrics reviews of critical group deliverables, provide direct leadership on escalated performance items, establish performance goals and job profiles for team members, develop potential successors and coach team members
Seniority
Principal/Senior Manager, hands-on IC with strategic leadership