New College Grad - HBM Product Development Failure Analysis Engineer
Core
Identify, analyze, and resolve product and process-related issues impacting yield, reliability, and performance of next-generation High Bandwidth Memory (HBM) products through electrical, physical, and statistical failure analysis.
Role type
New College Grad HBM Product Development Failure Analysis Engineer
Builds
Next-generation High Bandwidth Memory (HBM) products for high-volume manufacturing
Domain
Semiconductor manufacturing / Memory and storage solutions
Deliverable
production ML models | product features
Required skills
Electrical characterization, physical analysis techniques, statistical methodologies, Python programming, data analysis, root cause analysis, multi-functional collaboration
Preferred skills
Master's degree in EE/CS/Physics/Materials Science, semiconductor failure analysis experience, yield enhancement experience, reliability engineering, AI/Generative AI tools application, advanced memory technologies knowledge, statistical software/machine learning techniques
Technologies
Python, AI-enabled data analysis tools, statistical software
Responsibilities
Perform electrical, physical, and statistical failure analysis to identify component failure mechanisms; Analyze characterization and manufacturing data to determine root causes of failures; Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield and reliability issues; Leverage AI-enabled tools and statistical methods to evaluate large datasets and improve component performance; Communicate findings, corrective actions, and risk assessments to support product qualification and production ramp
Seniority
Entry-level, New College Grad