Principal Engineer Photolithography DRAM Process Development (Evergreen)
Core
Lead photolithography process development for next-generation DRAM, translating concepts to manufacturable solutions on pilot lines and high-volume fabs.
Role type
Principal Engineer, Photolithography Process Development
Builds
Next-generation DRAM memory nodes
Domain
Semiconductor manufacturing / Photolithography
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> production ML models (Incorrect mapping, correcting to: physical/clinical work -> infrastructure/production models context) -> Actually: production ML models is wrong. The deliverable is physical chips/processes. Let's map to 'production ML models' is not right. The options are: production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work. This role builds physical products (DRAM) via process. 'product features' or 'infrastructure'? It builds the process for the product. Let's use 'product features' as it defines the manufacturable solution for the DRAM product, or 'infrastructure' for the fab process. Given 'manufacturable solutions', 'product features' fits best as the output is the feature set of the DRAM.
Required skills
Photolithography process development, Imaging fundamentals, Track and overlay control, Reticle management, OPC (Optical Proximity Correction), Scanner systems operation, DOE (Design of Experiments), Root cause analysis, Vendor engagement for equipment/materials, Cross-functional team leadership
Preferred skills
MS or PhD in semiconductor field, R&D to production transfer experience, Data analysis and scripting, Data science and GenAI tools, Technical presentation skills
Technologies
EUV, 193i, 248nm, 365nm lithography tools, Scanner systems, OPC software
Responsibilities
Develop and optimize photo processes to meet device physical and electrical requirements, Lead a lithography module across multiple node technologies, Partner with integration teams and drive vendor engagement, Analyze failures and perform root cause analysis, Document plans and drive transfer to production fabs
Seniority
Principal, hands-on IC with strategic roadmap ownership
