Process Integration Engineer
Core
Transfer and introduce DRAM nodes from Technology Development to a new state-of-the-art manufacturing facility, driving yield ramp, cost reduction, and quality improvement to production level.
Role type
Process Integration Engineer (PIE)
Builds
DRAM memory and storage solutions for the semiconductor industry
Domain
Semiconductor manufacturing (Fab)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
root cause investigation, failure analysis, Design of Experiments (DOE), yield improvement, cost efficiency optimization, process startup, equipment/material evaluation, technology transfer coordination
Preferred skills
module ownership, trend sustaining, 300mm semiconductor environment experience, SWR (Start-up, Ramp-up, Sustaining)
Technologies
300mm semiconductor environment, DRAM nodes
Responsibilities
Conduct root cause investigations and failure analysis; Drive improvements in yield, cost efficiency, and quality; Run Design of Experiments (DOE) to enhance process capability; Address top detractors to improve device yield and reliability; Lead workshops during technology transfer; Start up, develop, and optimize processes; Coordinate and execute process, equipment, and material evaluations; Validate and qualify new processes, tools, and materials
Seniority
Mid-level, hands-on IC
