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R&D Thin Films Process Development Engineer Advanced DRAM

Boise, ID - Main Site💼 Full-time🗓 2026-08-12 → 2026-09-26

Core

Develop and optimize thin-film deposition processes (dielectric) to build high aspect ratio advanced DRAM features and devices.

Role type

Senior IC process development engineer (semiconductor thin films)

Builds

Next-generation DRAM devices and high aspect ratio features

Domain

Semiconductor manufacturing / Advanced DRAM / Materials science

Deliverable

Production ML models | product features

Required skills

Thin-film deposition process troubleshooting, ALD/epitaxy/plasma-based deposition fundamentals, DOE/SPC/data-driven methods, materials characterization, model-based problem solving

Preferred skills

AI/coding/automation in process development, cross-functional teamwork

Technologies

ALD, epitaxy, plasma-based deposition tools

Responsibilities

Drive feasibility studies for new thin-film deposition processes, improve key film metrics (uniformity, conformality, quality, selectivity), lead initiatives to meet program KPIs, interact with cross-functional teams and suppliers, execute project roadmaps and development timelines

Seniority

Senior, hands-on IC

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