Principal Engineer – NAND Process Pathfinding – Dry Etch
Core
Developing next-generation NAND memory technology through advanced dry etch process pathfinding and equipment management.
Role type
Principal Engineer – Dry Etch (Semiconductor R&D)
Builds
High-performance NAND memory solutions for AI, mobile, automotive, and data center applications
Domain
Semiconductor manufacturing / Memory technology / Dry Etch
Deliverable
production ML models | product features
Required skills
ICP/CCP plasma etch technologies, plasma-surface interactions, etch chemistry, profile control, dry etch equipment fundamentals, plasma physics, semiconductor process integration, statistical analysis, data analytics, process optimization
Preferred skills
High aspect ratio etch, advanced pattern transfer, selective etch, structural process optimization, machine learning, predictive modeling, automation, virtual process modeling, mentoring engineers
Technologies
AI/ML tools, statistical methodologies, automation, predictive modeling, digital workflows
Responsibilities
Explore advanced dry etch methods to satisfy structural, electrical, yield, and integration demands; Develop new plasma chemistries, process technologies, and equipment capabilities; Apply advanced data analytics and AI/ML tools to accelerate process learning; Drive process pathfinding through automation and predictive modeling; Collaborate with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, and Device teams
Seniority
Principal, hands-on IC with strategy & mentorship