CMOS Device Integration Team - DMTS
Core
Leading CMOS device and module development for next-generation DRAM, HBM, and Compute-in-Memory architectures to enable AI and high-performance computing.
Role type
Distinguished Member of Technical Staff (Distinguished IC)
Builds
Advanced memory products (DRAM, HBM, Compute-in-Memory)
Domain
Semiconductor / Memory Technology
Deliverable
production ML models | product features
Required skills
Advanced CMOS device design and integration, Electrical characterization of CMOS devices and circuits, Cross-functional technology project leadership, Semiconductor industry experience at leading foundry or DRAM manufacturer
Preferred skills
PhD in Electrical Engineering, High-performance logic technologies at 5nm and beyond, Semiconductor device physics and process integration expertise, Technical direction influence
Technologies
CMOS, DRAM, HBM, 5nm logic technologies, TCAD, Modeling
Responsibilities
Develop and integrate advanced CMOS devices for next-gen memory architectures, Perform detailed electrical characterization to drive performance improvements, Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams, Provide technical leadership and strategic recommendations for technology direction
Seniority
Distinguished, hands-on IC with strategic influence